- 您现在的位置：买卖IC网 > Datasheet目录479 > MPXHZ6116A6U (Freescale Semiconductor)SENSOR ABS PRESS 115KPA Datasheet资料下载
参数资料
| 型号： | MPXHZ6116A6U |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 4/10页 |
| 文件大小： | 0K |
| 描述： | SENSOR ABS PRESS 115KPA |
| 标准包装： | 65 |
| 系列： | MPXHZ6116A |
| 压力类型： | 绝对 |
| 工作压力： | 2.9 PSI ~ 16.6 PSI，20 ~ 115 kPa |
| 输出： | 0.399 ~ 4.645V |
| 精确度： | ±1.5% |
| 电源电压： | 4.75 V ~ 5.25 V |
| 端接类型： | PCB |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 8-SSOP |
Pressure
On-chip Temperature Compensation and Calibration
The performance over temperature is achieved by
integrating the shear–stress strain gauge, temperature
compensation, calibration, and signal conditioning circuitry
onto a single monolithic chip.
Figure 2 illustrates the configuration in the basic chip
carrier (case 1317) prior to porting. A gel die coat isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm. The gel die coat and durable thermoplastic
package provide a media resistant barrier that allows the
sensor to operate reliably in high humidity conditions as well
as common automotive media. NOTE: The MPXHZ6116A
series pressure sensor ’s operating characteristics, internal
reliability and qualification tests are based on use of air as the
pressure media. Media, other than air, may have adverse
effects on sensor performance and long–term reliability.
Contact the factory for information regarding media
compatibility in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the integrated sensor to the A/D input of a
microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Fluoro Silicone
Gel Die Coat
Die
Stainless
Steel Cap
+5.0 V
Wire Bond
Lead
Frame
P1
Thermoplastic
Case
100 nF
V S Pin 2
MPXHZ6116A
V out Pin 4
to ADC
Sealed Vacuum Reference
Absolute Element
Die Bond
GND Pin 3
47 pF
51 K
Figure 2. Cross Sectional Diagram SSOP (not to scale)
Figure 3. Typical Application Circuit
V out = V S (0.008938 x P (kPa) - 0.09895)
± (1.5 x TM x V x 0.008938)
V S = 5.0 V ± 0.25
(Output Source Current Operation)
5.0
4.5
S
4.0 TEMP = 0 to 85oC
3.5
3.0
2.5
2.0
1.5
1.0
0.5
MAX
MIN
NOM
0
PRESSURE (kPa)
Figure 4. Output vs. Absolute Pressure
MPXHZ6116A
Sensors
4
Freescale Semiconductor
相关PDF资料 |
PDF描述 |
|---|---|
| MPXV2050GP | SENSOR INTEG SILICON PRESSURE |
| MPXV7007GP | PRESSURE SENSOR SIDE PORT 8-SOP |
| MR1-6LVW-WSP | POWERWHITE LV WW SPOT OPTIC |
| MRF24J40MBT-I/RM | IC TXRX 2.4GHZ 802.15.4 |
| MRF24J40MCT-I/RM | TXRX MOD 802.15.4 2.4GHZ 12MOD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MPXHZ6117A | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure,On-Chip Signal Conditioned,Temperature Compensated and Calibrated |
| MPXHZ6117A6T1 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure,On-Chip Signal Conditioned,Temperature Compensated and Calibrated |
| MPXHZ6117A6U | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure,On-Chip Signal Conditioned,Temperature Compensated and Calibrated |
| MPXHZ6117AC6T1 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure,On-Chip Signal Conditioned,Temperature Compensated and Calibrated |
| MPXHZ6117AC6U | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure,On-Chip Signal Conditioned,Temperature Compensated and Calibrated |
发布紧急采购，3分钟左右您将得到回复。