
3–110
Motorola Sensor Device Data
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ON–CHIP TEMPERATURE COMPENSATION, CALIBRATION and SIGNAL CONDITIONING
Figure 2. Output versus Pressure Differential
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum out-
put curves are shown for operation over a temperature
range of 0
°
to 85
°
C using the decoupling circuit shown
in Figure 4. The output will saturate outside of the spe-
cified pressure range.
O
5
4.5
4
3.5
3
PRESSURE (kPa)
TYP
MAX
MIN
0
0
1
2
3
4
5
6
7
8
9
1
2.5
2
1.5
1
0.5
1
VS = 5 Vdc
TA = 25
°
C
MPX5100
S
O
OFFSET
(TYP)
ééééééééééé
ééééééééééé
ééééééééééé
FLUORO SILICONE
WIRE BOND
LEAD FRAME
DIE
STAINLESS STEEL
CASE
DIE
BOND
ééééééééééé
ééééééééééé
ééééééééééé
ééééééééééé
FLUORO SILICONE
GEL DIE COAT
WIRE BOND
LEAD FRAME
DIE
STAINLESS STEEL
METAL COVER
EPOXY PLASTIC
CASE
DIE
BOND
Figure 3. Cross–Sectional Diagrams
(Not to Scale)
Figure 3 illustrates both the Differential/Gauge and the
Absolute Sensing Chip in the basic chip carrier (Case 867).
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the sensor diaphragm.
The MPX5100 series pressure sensor operating char-
acteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long–term reliability. Contact the fac-
tory for information regarding media compatibility in your
application.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D in-
put of a microprocessor or microcontroller. Proper decoup-
ling of the power supply is recommended.
Figure 4. Recommended power supply decoupling
and output filtering.
For additional output filtering, please refer to
Application Note AN1646.
1.0 F
IPS
470 pF
OUTPUT
Vs
5 V
0.01 F
GND
Vout
F
Freescale Semiconductor, Inc.
n
.