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参数资料
| 型号： | MRF393 |
| 厂商： | MOTOROLA INC |
| 元件分类： | 功率晶体管 |
| 英文描述： | BROADBAND PUSH-PULL RF POWER TRANSISTOR NPN SILICON |
| 中文描述： | 2 CHANNEL, UHF BAND, Si, NPN, RF POWER TRANSISTOR |
| 封装： | CASE 744A-01, 8 PIN |
| 文件页数： | 2/4页 |
| 文件大小： | 118K |
| 代理商： | MRF393 |
MRF393
2
MOTOROLA RF DEVICE DATA
ELECTRICAL CHARACTERISTICS
(TC = 25
°
C unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
(1)
Collector–Emitter Breakdown Voltage (IC = 50 mAdc, IB = 0)
Collector–Emitter Breakdown Voltage (IC = 50 mAdc, VBE = 0)
Emitter–Base Breakdown Voltage (IE = 5.0 mAdc, IC = 0)
Collector Cutoff Current (VCB = 30 Vdc, IE = 0)
ON CHARACTERISTICS
(1)
V(BR)CEO
V(BR)CES
V(BR)EBO
ICBO
30
—
—
Vdc
60
—
—
Vdc
4.0
—
—
Vdc
—
—
5.0
mAdc
DC Current Gain (IC = 1.0 Adc, VCE = 5.0 Vdc)
DYNAMIC CHARACTERISTICS
(1)
hFE
20
—
100
—
Output Capacitance (VCB = 28 Vdc, IE = 0, f = 1.0 MHz)
FUNCTIONAL TESTS
(2)
— See Figure 1
Cob
40
75
95
pF
Common–Emitter Amplifier Power Gain
(VCC = 28 Vdc, Pout = 100 W, f = 500 MHz)
Gpe
7.5
8.5
—
dB
Collector Efficiency
(VCC = 28 Vdc, Pout = 100 W, f = 500 MHz)
η
50
55
—
%
Load Mismatch
(VCC = 28 Vdc, Pout = 100 W, f = 500 MHz,
VSWR = 30:1, all phase angles)
ψ
No Degradation in Output Power
NOTES:
1. Each transistor chip measured separately.
2. Both transistor chips operating in push–pull amplifier.
Figure 1. 500 MHz Test Fixture
D.U.T.
Z1
C9
C11
L5
Z3
Z5
L6
C16
C7
C6
C4
C3
+ 28 V
L3
L4
C2
C1
Z2
Z4
Z6
C12
B1
B2
L1
C13
C14
C15
C10
L2
C8
C5
C1, C2, C7, C8 — 240 pF 100 mil Chip Cap
C3 — 15 pF 100 mil Chip Cap
C4 — 24 pF 100 mil Chip Cap
C5 — 33 pF 100 mil Chip Cap
C6 — 12 pF 100 mil Chip Cap
C9, C13 — 1000 pF 100 mil Chip Cap
C10, C14 — 680 pF Feedthru Cap
C11, C15 — 0.1
μ
F Ceramic Disc Cap
C12, C16 — 50
μ
F 50 V
L1
,
L2 — 0.15
μ
H Molded Choke with Ferrite Bead
L3
,
L4 — 2–1/2 Turns #20 AWG 0.200
″
ID
L5
,
L6 — 3–1/2 Turns #18 AWG 0.200
″
ID
B1, B2 — Balun 50
Semi Rigid Coax, 86 mil OD, 4
″
Long
Z1, Z2 — 850 mil Long x 125 mil W. Microstrip
Z3, Z4 — 200 mil Long x 125 mil W. Microstrip
Z5, Z6 — 800 mil Long x 125 mil W. Microstrip
Board Material — 0.0325
″
Teflon–Fiberglass,
ε
r = 2.56,
Board Material —
1 oz. Copper Clad both sides.
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