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参数资料
| 型号： | MS425PJB682MSZ |
| 厂商： | COILCRAFT INC |
| 元件分类： | 通用定值电感 |
| 英文描述： | 1 ELEMENT, 6.8 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 文件页数： | 1/2页 |
| 文件大小： | 224K |
| 代理商： | MS425PJB682MSZ |
1102 Silver Lake Road
Cary IL 60013
Phone
Fax
800-981-0363
847-639-1508
E-mail
Web
cp@coilcraft.com
www.coilcraft-cps.com
Coilcraft, Inc. 2009
These parts are preproduction products for electrical evaluation only.
Specification subject to change without notice.
MilitaryGradePowerInductors MS425PJB
POWER INDUCTORS
Document MS435-1
Revised 07/29/09
Core material Ferrite
Terminations Tin-lead (63/37) over silver-palladium-platinum-glass frit.
Weight 54 – 64 mg
Ambient temperature –55°C to +105°C with
Irms current, +105°C
to +155°C with derated current
Storage temperature Component: –55°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging 1000/7
″ reel; 3500/13″ reel
Plastic tape: 12 mm wide, 0.23 mm thick, 8 mm pocket spacing,
1.9 mm pocket depth
Recommended pick and place nozzle OD: 4 mm; ID:
≤ 2 mm
DCR
SRF
Isat (A)5
Irms (A)6
Inductance2 max3
typ4 10% 20%
30%
20°C 40°C
Part number1
(H)
(Ohms) (MHz) drop drop drop
rise
MS425PJB351MSZ
0.35 ±20%
0.040
360
5.9
6.1
6.3
2.2
3.1
MS425PJB561MSZ
0.56 ±20%
0.030
250
4.8
5.2
5.3
1.9
2.8
MS425PJB102NSZ
1.0 ±30%
0.040
180
2.8
3.0
3.1
1.8
2.7
MS425PJB222MSZ
2.2 ±20%
0.070
90
2.7
2.8
2.9
1.6
2.3
MS425PJB332MSZ
3.3 ±20%
0.080
75
2.1
2.3
2.4
1.4
2.0
MS425PJB472MSZ
4.7 ±20%
0.125
65
1.8
1.9
1.3
1.8
MS425PJB682MSZ
6.8 ±20%
0.150
50
1.2
1.3
1.0
1.5
MS425PJB103MSZ
10 ±20%
0.200
40
1.1
1.2
1.3
0.90
1.25
MS425PJB153MSZ
15 ±20%
0.260
32
0.86
0.91
0.94
0.80
1.12
MS425PJB183MSZ
18 ±20%
0.270
27
0.78
0.83
0.85
0.70
1.00
MS425PJB223MSZ
22 ±20%
0.360
26
0.74
0.80
0.83
0.65
0.90
MS425PJB333MSZ
33 ±20%
0.420
20
0.58
0.64
0.68
0.55
0.80
MS425PJB473MSZ
47 ±20%
0.650
16
0.51
0.55
0.56
0.45
0.68
MS425PJB683MSZ
68 ±20%
0.950
13
0.41
0.45
0.46
0.40
0.56
MS425PJB104MSZ
100 ±20%
1.40
10
0.34
0.36
0.37
0.35
0.50
MS425PJB124MSZ
120 ±20%
1.60
9.0
0.31
0.33
0.34
0.30
0.45
MS425PJB154MSZ
150 ±20%
2.00
8.0
0.27
0.29
0.30
0.28
0.40
MS425PJB184MSZ
180 ±20%
2.50
7.5
0.24
0.26
0.27
0.26
0.36
MS425PJB224MSZ
220 ±20%
3.70
6.5
0.21
0.225 0.235 0.20
0.30
MS425PJB334MSZ
330 ±20%
5.90
5.5
0.18
0.19
0.20
0.17
0.23
MS425PJB474MSZ
470 ±20%
7.80
4.5
0.14
0.16
0.17
0.15
0.20
MS425PJB564MSZ
560 ±20%
10.0
4.0
0.13
0.14
0.15
0.14
0.18
MS425PJB684MSZ
680 ±20%
11.5
3.5
0.12
0.13
0.14
0.12
0.16
MS425PJB824MSZ
820 ±20%
14.0
2.9
0.11
0.12
0.13
0.10
0.14
MS425PJB105MSZ 1000 ±20%
18.0
2.8
0.10
0.11
0.098 0.125
MS425PJB155MSZ 1500 ±20%
25.0
2.4
0.095 0.10
0.105 0.080 0.110
MS425PJB185MSZ 1800 ±20%
31.5
2.3
0.090 0.095 0.100 0.070 0.095
MS425PJB225MSZ 2200 ±20%
32.5
2.1
0.088 0.099 0.100 0.070 0.090
MS425PJB335MSZ 3300 ±20%
48.0
1.6
0.082 0.092 0.094 0.055 0.075
■ High temperature materials allow operation in ambient
temperatures up to 155°C
■ Special construction allows it to pass vibration testing to
80 G and shock testing to 1000 G.
■ Tin-lead (Sn-Pb) termination for the best possible board
adhesion
1. When ordering, please specify testing code:
MS425PJB105MS
Z
Testing: Z = Coilcraft Critical Products Environmental
Stress Conditions Testing.
H = Coilcraft Qual + Coilcraft Hi-Rel Burn-in
P = Coilcraft Qual + MIL-STD-981 Class S
Group A screening
N = Coilcraft Qual + MIL-STD-981 Class B
Group A screening
C = Coilcraft Qual + MIL-STD-981 Class S
Group A screening + MIL-STD-981
Class S Group B qualification
W= Coilcraft Qual + MIL-STD-981 Class B
Group A screening + MIL-STD-981
Class S Group B qualification
2. Inductance tested at 100 kHz, 0.1 Vrms using an
Agilent/HP 4192A. Inductance at 1 MHz is the same
for parts with SRF
≥10 MHz.
3. DCR measured on a micro-ohmmeter.
4. SRF measured using Agilent/HP 8753ES or
equivalent.
5. DC current that causes the specified inductance drop
from its value without current.
6. Current that causes the specified temperature rise
from 25°C ambient.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components”
before soldering.
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