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参数资料
| 型号： | MSK5920-2.5RHU |
| 厂商： | MS KENNEDY CORP |
| 元件分类： | 固定正电压单路输出LDO稳压器 |
| 英文描述： | RAD TOLERANT ULTRA LOW DROPOUT POSITIVE LINEAR REGULATOR |
| 中文描述： | 2.5 V FIXED POSITIVE LDO REGULATOR, 0.45 V DROPOUT, CSFM5 |
| 封装： | HERMETIC SEALED, SIP-5 |
| 文件页数： | 4/8页 |
| 文件大小： | 431K |
| 代理商： | MSK5920-2.5RHU |
APPLICATION NOTES CONT.
4
To select a heat sink for the MSK 5920RH, the follow-
ing formula for convective heat flow may be used.
Governing Equation:
TJ = PD X (RθJC + RθCS + RθSA) + TA
Where
TJ
= Junction Temperature
PD
= Total Power Dissipation
RθJC = Junction to Case Thermal Resistance
RθCS = Case to Heat Sink Thermal Resistance
RθSA = Heat Sink to Ambient Thermal Resistance
TA
= Ambient Temperature
Power Dissipation=(VIN-VOUT) x IOUT
Next, the user must select a maximum junction tem-
perature. The absolute maximum allowable junction tem-
perature is 150°C. The equation may now be rearranged
to solve for the required heat sink to ambient thermal
resistance (RθSA).
Example:
An MSK 5920-2.5RH is connected for VIN=+3.3V and
VOUT=+2.5V. IOUT is a continuous 3A DC level. The am-
bient temperature is +25°C. The maximum desired junc-
tion temperature is +125°C.
RθJC=4.0°C/W and RθCS=0.15°C/W for most thermal
greases
Power Dissipation=(3.3V-2.5V) x (3A)
=2.4 Watts
Solve for RθSA:
125°C - 25°C
2.4W
= 36.5°C/W
In this example, a heat sink with a thermal resistance
of no more than 36.5°C/W must be used to maintain a
junction temperature of no more than 125°C.
The MSK 5920RH control circuitry has a thermal shut-
down temperature of approximately 150°C. This ther-
mal shutdown can be used as a protection feature, but
for continuous operation, the junction temperature of the
pass transistor must be maintained below 150°C. Proper
heat sink selection is essential to maintain these condi-
tions. Exceeding the thermal limit activates the latch fea-
ture of the MSK 5920RH. Toggle the shutdown pin high
them low or cycle power to reset the latch. See shut-
down pin description and overcurrent latch description
for more information.
TYPICAL APPLICATIONS CIRCUIT
RθSA=
-4.0°C/W - 0.15°C/W
FIGURE 2
Rev. P 1/11
THERMAL LIMITING
HEAT SINK SELECTION
Radiation performance curves for TID testing have been
generated for all radiation testing performed by MS
Kennedy. These curves show performance trends
throughout the TID test process and can be located in
the MSK 5920RH radiation test report. The complete
radiation test report is available in the RAD HARD PROD-
UCTS section on the MSK website.
TOTAL DOSE RADIATION TEST
PERFORMANCE
http://www.mskennedy.com/store.asp?pid=9951&catid=19680
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