参数资料
型号: MSM63182-XXXGS-K
厂商: OKI ELECTRIC INDUSTRY CO LTD
元件分类: 微控制器/微处理器
英文描述: 4-BIT, MROM, 2 MHz, MICROCONTROLLER, PQFP128
封装: 14 X 20 MM, 0.50 MM PITCH, PLASTIC, QFP-128
文件页数: 20/27页
文件大小: 218K
代理商: MSM63182-XXXGS-K
Semiconductor
MSM63182
27/27
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
QFP128-P-1420-0.50-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5
mm or more
1.19 TYP.
Mirror finish
相关PDF资料
PDF描述
MSM63184B-XXXGS-K 4-BIT, MROM, 2 MHz, MICROCONTROLLER, PQFP128
MSM63184B-XXX 4-BIT, MROM, 2 MHz, MICROCONTROLLER, UUC123
MSM6351-XXGS-L 4-BIT, MROM, 0.032768 MHz, MICROCONTROLLER, PQFP100
MSM6352-XXGS-K 4-BIT, MROM, MICROCONTROLLER, PQFP44
MSM63P180-NGS-BK 4-BIT, OTPROM, 2 MHz, MICROCONTROLLER, PQFP176
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