参数资料
型号: MSM63184B-XXXGS-K
厂商: LAPIS SEMICONDUCTOR CO LTD
元件分类: 微控制器/微处理器
英文描述: 4-BIT, MROM, 2 MHz, MICROCONTROLLER, PQFP128
封装: 14 X 20 MM, 0.50 MM PITCH, PLASTIC, QFP-128
文件页数: 28/30页
文件大小: 254K
代理商: MSM63184B-XXXGS-K
Semiconductor
MSM63184B
6/29
PAD CONFIGURATION
Pad Layout
Chip Size
: 5.35 mm 4.66 mm
Chip Thickness
: 350 mm (typ.)
Coordinate Origin
: Chip center
Pad Hole Size
: 100 mm 100 mm
Pad Size
: 110 mm 110 mm
Minimum Pad Pitch
: 140 mm
Note: The chip substrate voltage is VSS.
Y
X
97
P6.0
96
P6.1
95
P6.2
94
P6.3
93
P1.0
92
P1.1
91
P1.2
90
P1.3
89
PA.0
88
PA.1
87
PA.2
86
PA.3
85
P9.0
84
P9.1
83
P9.2
82
P9.3
81
P8.0
80
P8.1
79
P8.2
78
P8.3
77
PE.0
76
PE.1
75
PE.2
74
PE.3
73
PD.0
72
PD.1
71
PD.2
70
PD.3
69
P0.0
68
P0.1
67
P0.2
66
P0.3
65
P4.0
64
P4.1
63
P4.2
62
P4.3
61
P5.0
60 P5.1
59 P5.2
58 P5.3
57 TST1
56 TST2
55 XT0
54 XT1
53 RESET
52 OSC0
51 OSC1
50 VDDL
49 VDD
48 CB2
47 CB1
46 VDDH
45 C2
44 C1
43 VDD5
42 VDD4
41 VDD3
40 VDD2
39 VDD1
38 VSS
SEG36
1
SEG35
2
SEG34
3
SEG33
4
SEG32
5
SEG31
6
SEG30
7
SEG29
8
SEG28
9
SEG27
10
SEG26
11
SEG25
12
SEG24
13
SEG23
14
SEG22
15
SEG21
16
SEG20
17
SEG19
18
SEG18
19
SEG17
20
SEG16
21
SEG15
22
SEG14
23
SEG13
24
SEG12
25
SEG11
26
SEG10
27
SEG9
28
SEG8
29
SEG7
30
SEG6
31
SEG5
32
SEG4
33
SEG3
34
SEG2
35
SEG1
36
SEG0
37
P7.3
98
P7.2
99
P7.1 100
P7.0 101
BD 102
BDB 103
VDDI 104
COM1 105
COM2 106
COM3 107
COM4 108
COM5 109
COM6 110
COM7 111
COM8 112
COM9 113
COM10 114
COM11 115
COM12 116
COM13 117
COM14 118
COM15 119
COM16 120
SEG39 121
SEG38 122
SEG37 123
相关PDF资料
PDF描述
MSM63184B-XXX 4-BIT, MROM, 2 MHz, MICROCONTROLLER, UUC123
MSM6351-XXGS-L 4-BIT, MROM, 0.032768 MHz, MICROCONTROLLER, PQFP100
MSM6352-XXGS-K 4-BIT, MROM, MICROCONTROLLER, PQFP44
MSM63P180-NGS-BK 4-BIT, OTPROM, 2 MHz, MICROCONTROLLER, PQFP176
MSM6404VS 4-BIT, MICROCONTROLLER, CDIP42
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