参数资料
型号: MSM66507-XXXJS-B
厂商: OKI ELECTRIC INDUSTRY CO LTD
元件分类: 微控制器/微处理器
英文描述: 16-BIT, MROM, 32 MHz, MICROCONTROLLER, PQCC84
封装: 0.115 INCH, 1.27 MM PITCH, PLASTIC, LCC-84
文件页数: 17/24页
文件大小: 276K
代理商: MSM66507-XXXJS-B
24/24
Semiconductor
MSM66507/66P507
(Unit : mm)
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
QFJ84-P-S115-1.27-B
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
Cu alloy
Solder plating
5 mm or more
6.30 TYP.
Mirror finish
相关PDF资料
PDF描述
MSM66P573-TB 16-BIT, OTPROM, 24 MHz, MICROCONTROLLER, PQFP100
MSM66P573-XXTB 16-BIT, OTPROM, 24 MHz, MICROCONTROLLER, PQFP100
MSM66Q573Y-XXTB 16-BIT, FLASH, 26 MHz, MICROCONTROLLER, PQFP100
MSM66Q573-NTB 16-BIT, FLASH, 30 MHz, MICROCONTROLLER, PQFP100
MSM66Q573-XXTB 16-BIT, FLASH, 30 MHz, MICROCONTROLLER, PQFP100
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