参数资料
型号: MSM82C43RS
厂商: LAPIS SEMICONDUCTOR CO LTD
元件分类: 微控制器/微处理器
英文描述: 20 I/O, PIA-GENERAL PURPOSE, PDIP24
封装: 0.600 INCH, 2.54 MM PITCH, PLASTIC, DIP-24
文件页数: 6/14页
文件大小: 141K
代理商: MSM82C43RS
Semiconductor
MSM82C43
13/13
(Unit : mm)
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
SOP24-P-430-1.27-K
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.
Mirror finish
相关PDF资料
PDF描述
MSM82C51A-2JS 1 CHANNEL(S), 64K bps, SERIAL COMM CONTROLLER, PQCC28
MSM82C51A-2GS-K 1 CHANNEL(S), 64K bps, SERIAL COMM CONTROLLER, PDSO32
MSM82C55A-2VJS 24 I/O, PIA-GENERAL PURPOSE, PQCC44
MSM82C55A-2RS 24 I/O, PIA-GENERAL PURPOSE, PDIP40
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相关代理商/技术参数
参数描述
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MSM82C53-2 GS-K 制造商:ROHM Semiconductor 功能描述: