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参数资料
| 型号： | MSP1N5241DUR-1E3 |
| 厂商： | MICROSEMI CORP-SCOTTSDALE |
| 元件分类： | 参考电压二极管 |
| 英文描述： | 11 V, 0.5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-213AA |
| 封装： | ROHS COMPLIANT, HERMETIC SEALED, GLASS, MLL34, MELF-2 |
| 文件页数： | 1/3页 |
| 文件大小： | 152K |
| 代理商： | MSP1N5241DUR-1E3 |
METALLURGICALLY BONDED GLASS
SURFACE MOUNT 500 mW ZENERS
WWW
.Microse
m
i
.CO
M
S C O T TS DALE DIVISION
1N5221UR-1 thru 1N5281BUR-1,e3
(or MLL5221-1 thru MLL5281B-1,e3)
1N5
221
UR
thru
1N5281
BUR
DESCRIPTION
APPEARANCE
The 1N5221BUR-1 thru 1N5281BUR-1 series of 0.5 watt Zener Voltage
Regulators provides a surface mount equivalent to the popular JEDEC
registered 1N5221B to 1N5281B for 2.4 to 200 volts in a metallurgically
bonded configuration. They are available with standard 5%, 10%, or 20%
tolerances as well as tighter tolerances identified by different suffix letters on
the part number. Microsemi also offers numerous other Zener products to
meet higher and lower power applications.
DO-213AA
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
Surface mount equivalents to the JEDEC registered
1N5221 thru 1N5281B series
Hermetically sealed surface mount package
Internal metallurgical bond
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers
RoHS Compliant devices available by adding “e3” suffix
DO-7 or DO-35 glass body axial-leaded Zener
equivalents also available per JEDEC registration (see
separate data sheet for part numbers 1N5221 thru
1N5281B series
Regulates voltage over a broad operating
current and temperature range
Selection from 2.4 to 200 V
Standard voltage tolerances are plus/minus 5%
with B suffix identification and 10 % with A suffix
Tight tolerances available in plus or minus 2%
or 1% with C or D suffix respectively
Nonsensitive to ESD per MIL-STD-750 Method 1020
Minimal capacitance (see Figure 3)
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
Operating and Storage temperature: -65C to +175C
Thermal Resistance: 100C/W junction to end cap
and 250
C/W junction to ambient when mounted on
FR4 PC board (1 oz Cu) with recommended footprint
(see last page)
Steady-State Power: 0.5 watts at end cap
temperature TEC < 125
oC or ambient temperature T
A
< 50
C when mounted on FR4 PC board as described
for thermal resistance above (see Figure 2 for
derating)
Forward voltage @200 mA: 1.1 volts (maximum)
Solder Temperatures: 260 C for 10 seconds (max)
CASE: Hermetically sealed glass DO-213AA
(SOD80 or MLL34) MELF style package
FINISH: End caps Tin-Lead or RoHS Compliant
annealed matte-Tin plating solderable per MIL-STD-
750, method 2026
POLARITY: Cathode indicated by band where
diode is to be operated with the banded end positive
with respect to the opposite end for Zener regulation
MARKING: cathode band only
TAPE & REEL option: Standard per EIA-481-B with
12 mm tape, 2000 per 7 inch reel or 5000 per 13
inch reel (add “TR” suffix to part number)
WEIGHT: 0.04 grams
See package dimensions on last page
Microsemi
Scottsdale Division
Page 1
Copyright
2005
8-29-2005 REV A
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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