参数资料
型号: MSP430F1232IRHBT
厂商: TEXAS INSTRUMENTS INC
元件分类: 微控制器/微处理器
英文描述: 16-BIT, FLASH, 8 MHz, RISC MICROCONTROLLER, PQCC32
封装: PLASTIC, QFN-32
文件页数: 8/52页
文件大小: 1174K
代理商: MSP430F1232IRHBT
MSP430x11x2, MSP430x12x2
MIXED SIGNAL MICROCONTROLLER
SLAS361D JANUARY 2002 REVISED AUGUST 2004
16
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
peripheral file map (continued)
PERIPHERALS WITH BYTE ACCESS (CONTINUED)
Port P3
(in MSP430x12x2 only)
Port P3 selection
Port P3 direction
Port P3 output
Port P3 input
P3SEL
P3DIR
P3OUT
P3IN
01Bh
01Ah
019h
018h
Special Function
Module enable2
Module enable1
SFR interrupt flag2
SFR interrupt flag1
SFR interrupt enable2
SFR interrupt enable1
ME2
ME1
IFG2
IFG1
IE2
IE1
005h
004h
003h
002h
001h
000h
absolute maximum ratings
Voltage applied at VCC to VSS
0.3 V to 4.1 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage applied to any pin (see Note)
0.3 V to VCC + 0.3 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Diode current at any device terminal
±2 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, Tstg (unprogrammed device)
55
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, Tstg (programmed device)
40
°C to 85°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE: All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is applied
to the TEST pin when blowing the JTAG fuse.
recommended operating conditions
MIN
NOM
MAX
UNITS
Supply voltage during program execution, VCC (see Note 1)
MSP430F11x2
1.8
3.6
V
Supply voltage during program/erase flash memory, VCC
MSP430F11x2
MSP430F12x2
2.7
3.6
V
Supply voltage, VSS
0
V
Operating free-air temperature range, TA
MSP430F11x2
MSP430F12x2
40
85
°C
LF mode selected, XTS=0
Watch crystal
32 768
Hz
LFXT1 crystal frequency, f(LFXT1)
Ceramic resonator
450
8000
(see Note 1 & Note 2)
XT1 selected mode, XTS=1
Crystal
1000
8000
kHz
VCC = 1.8 V,
MSP430F11x2
MSP430F12x2
dc
4.15
Processor frequency f(system) (MCLK signal)
VCC = 3.6 V,
MSP430F11x2
MSP430F12x2
dc
8
MHz
NOTES:
1. The LFXT1 oscillator in LF-mode requires a resistor of 5.1 M
from XOUT to VSS when VCC <2.5 V.
The LFXT1 oscillator in XT1-mode accepts a ceramic resonator or a crystal frequency of 4 MHz at VCC ≥ 2.2 V.
The LFXT1 oscillator in XT1-mode accepts a ceramic resonator or a crystal frequency of 8 MHz at VCC ≥ 2.8 V.
2. The LFXT1 oscillator in LF-mode requires a watch crystal.
The LFXT1 oscillator in XT1-mode accepts a ceramic resonator or a crystal.
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