参数资料
型号: MSP430F2013IRSA
厂商: TEXAS INSTRUMENTS INC
元件分类: 微控制器/微处理器
英文描述: 16-BIT, FLASH, 16 MHz, RISC MICROCONTROLLER, PQCC16
封装: PLASTIC, QFN-16
文件页数: 28/92页
文件大小: 1672K
代理商: MSP430F2013IRSA
MSP430F20x3
MSP430F20x2
MSP430F20x1
SLAS491H
– AUGUST 2005 – REVISED AUGUST 2011
Crystal Oscillator, XT1, Low-Frequency Mode
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
LFXT1 oscillator crystal
fLFXT1,LF
XTS = 0, LFXT1Sx = 0 or 1
1.8 V to 3.6 V
32768
Hz
frequency, LF mode 0, 1
LFXT1 oscillator logic level
fLFXT1,LF,logic
square wave input frequency, XTS = 0, LFXT1Sx = 3
1.8 V to 3.6 V
10000
32768
50000
Hz
LF mode
XTS = 0, LFXT1Sx = 0,
500
fLFXT1,LF = 32768 Hz, CL,eff = 6 pF
Oscillation allowance for
OALF
k
LF crystals
XTS = 0, LFXT1Sx = 0,
200
fLFXT1,LF = 32768 Hz, CL,eff = 12 pF
XTS = 0, XCAPx = 0
1
XTS = 0, XCAPx = 1
5.5
Integrated effective load
CL,eff
pF
capacitance, LF mode(2)
XTS = 0, XCAPx = 2
8.5
XTS = 0, XCAPx = 3
11
XTS = 0, Measured at P1.0/ACLK,
Duty cycle, LF mode
2.2 V/3 V
30
50
70
%
fLFXT1,LF = 32768 Hz
Oscillator fault frequency,
fFault,LF
XTS = 0, LFXT1Sx = 3(4)
2.2 V/3 V
10
10000
Hz
LF mode(3)
(1)
To improve EMI on the XT1 oscillator, the following guidelines should be observed.
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
(g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This
signal is no longer required for the serial programming adapter.
(2)
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
(3)
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
(4)
Measured with logic-level input frequency but also applies to operation with crystals.
Internal Very-Low-Power Low-Frequency Oscillator (VLO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TA
VCC
MIN
TYP
MAX
UNIT
-40
°C to 85°C
4
12
20
fVLO
VLO frequency
2.2 V/3 V
kHz
105
°C
22
I: -40
°C to 85°C
dfVLO/dT
VLO frequency temperature drift(1)
2.2 V/3 V
0.5
%/
°C
T: -40
°C to 105°C
dfVLO/dVCC
VLO frequency supply voltage drift(2)
25
°C
1.8 V to 3.6 V
4
%/V
(1)
Calculated using the box method:
I: (MAX(-40 to 85
°C) - MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C - (-40°C))
T: (MAX(-40 to 105
°C) - MIN(-40 to 105°C)) / MIN(-40 to 105°C) / (105°C - (-40°C))
(2)
Calculated using the box method: (MAX(1.8 to 3.6 V) - MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V - 1.8 V)
Timer_A
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
Internal: SMCLK, ACLK
2.2 V
10
fTA
Timer_A clock frequency
External: TACLK, INCLK
MHz
3 V
16
Duty cycle = 50%
± 10%
tTA,cap
Timer_A capture timing
TA0, TA1
2.2 V/3 V
20
ns
34
Copyright
2005–2011, Texas Instruments Incorporated
相关PDF资料
PDF描述
MSP430F2001TN 16-BIT, FLASH, 16 MHz, RISC MICROCONTROLLER, PDIP14
MSP430F2003IRSAT 16-BIT, FLASH, 16 MHz, RISC MICROCONTROLLER, PQCC16
MSP430F2011IPWR 16-BIT, FLASH, 16 MHz, RISC MICROCONTROLLER, PDSO14
MSP430FG4270IDL 16-BIT, FLASH, 8 MHz, RISC MICROCONTROLLER, PDSO48
S-7750C71XX-HCT1 SPECIALTY MICROPROCESSOR CIRCUIT, PBGA16
相关代理商/技术参数
参数描述
MSP430F2013IRSAR 功能描述:16位微控制器 - MCU 16-Bit Ultra Low Pwr 1kB Flash 2kB RAM RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MSP430F2013IRSAT 功能描述:16位微控制器 - MCU 16-Bit Ultra Low Pwr 2kB Flash 128B RAM RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MSP430F2013QRSATEP 功能描述:16位微控制器 - MCU 16B Ultra-Low-Power MCU RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MSP430F2013TN 功能描述:16位微控制器 - MCU 16-Bit Ultra Low Pwr 1kB Flash 2kB RAM RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT
MSP430F2013TPW 功能描述:16位微控制器 - MCU 16-Bit Ultra Low Pwr 1kB Flash 2kB RAM RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT