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| 型号： | MSP430FE423AIPMR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 16-BIT, FLASH, 8.4 MHz, RISC MICROCONTROLLER, PQFP64 |
| 封装： | GREEN, PLASTIC, LQFP-64 |
| 文件页数： | 20/47页 |
| 文件大小： | 868K |
| 代理商： | MSP430FE423AIPMR |
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MSP430FE42xA
MIXED SIGNAL MICROCONTROLLER
SLAS588 -- FEBRUARY 2008
27
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature (unless otherwise
noted) (continued)
crystal oscillator, LFXT1 oscillator (see Notes 1 and 2)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
OSCCAPx = 0h
3V
0
C
Integrated inp t capacitance (see Note 4)
OSCCAPx = 1h
3V
10
pF
CXIN
Integrated input capacitance (see Note 4)
OSCCAPx = 2h
3V
14
pF
OSCCAPx = 3h
3V
18
OSCCAPx = 0h
3V
0
C
Integrated o tp t capacitance (see Note 4)
OSCCAPx = 1h
3V
10
pF
CXOUT
Integrated output capacitance (see Note 4)
OSCCAPx = 2h
3V
14
pF
OSCCAPx = 3h
3V
18
VIL
Inp t le els at XIN
see Note 3
2 2 V/3 V
VSS
0.2×VCC
V
VIH
Input levels at XIN
seeNote3
2.2 V/3 V
0.8×VCC
VCC
V
NOTES: 1. The parasitic capacitance from the package and board may be estimated to be 2pF. The effective load capacitor for the crystal is
(CXIN xCXOUT)/(CXIN +CXOUT). It is independent of XTS_FLL .
2. To improve EMI on the low-power LFXT1 oscillator, particularly in the LF mode (32 kHz), the following guidelines must be
observed:
Keep as short a trace as possible between the ’FE42xA and the crystal.
Design a good ground plane around oscillator pins.
Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
Avoid running PCB traces underneath or adjacent to XIN an XOUT pins.
Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation.
This signal is no longer required for the serial programming adapter.
3. Applies only when using an external logic-level clock source. XTS_FLL must be set. Not applicable when using a crystal or resonator.
4. External capacitance is recommended for precision real-time clock applications; OSCCAPx = 0h.
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| MSP430FE423IPM | 功能描述:16位微控制器 - MCU 8KB Flash 256B RAM for Energy Meters RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT |
| MSP430FE423IPMR | 功能描述:16位微控制器 - MCU 8KB Flash 256B RAM for Energy Meters RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT |
| MSP430FE4242IPM | 功能描述:16位微控制器 - MCU 16B Ultra-Low-Pwr Microcontroller RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT |
| MSP430FE4242IPMR | 功能描述:16位微控制器 - MCU 16B Ultra-Low-Pwr Microcontroller RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT |
| MSP430FE4252IPM | 功能描述:16位微控制器 - MCU 16B Ultra-Low-Pwr Microcontroller RoHS:否 制造商:Texas Instruments 核心:RISC 处理器系列:MSP430FR572x 数据总线宽度:16 bit 最大时钟频率:24 MHz 程序存储器大小:8 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:VQFN-40 安装风格:SMD/SMT |
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