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参数资料
| 型号： | MSP50P34N16E1A |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 数字信号处理 |
| 英文描述： | 0-BIT, 19.7 MHz, MIXED DSP, PDIP16 |
| 封装： | PLASTIC, DIP-16 |
| 文件页数： | 1/11页 |
| 文件大小： | 187K |
| 代理商： | MSP50P34N16E1A |
MSP50C32, MSP50C33, MSP50C34
MSP50P34, MSP50C37, MSP50P37
MIXED-SIGNAL PROCESSORS
SPSS019A – MAY 1997 – REVISED OCTOBER 1998
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Dual Programmable LPC-12 Speech
Synthesizers
D Simultaneous LPC and PCM Waveforms
D 8-Bit Microprocessor with 61 instructions
D 32 Twelve-Bit Words and 224 Bytes of RAM
D 3.3V to 6.5V CMOS Technology for Low
Power Dissipation
D Direct Speaker Drive Capability
D Mask Selectable Internal or External Clock
D Internal Clock Generator that Requires No
External Components
D Two Software-Selectable Clock Speeds
D 10-kHz or 8-kHz Speech Sample Rate
description
The MSP50x3x family uses a revolutionary architecture to combine an 8-bit microprocessor, two speech
synthesizers, ROM, RAM, and I/O in a low-cost single-chip system. The architecture uses the same arithmetic
logic unit (ALU) for the two synthesizers and the microprocessor, thus reducing chip area and cost and enabling
the microprocessor to do a multiply operation in 0.8
s. The MSP50x3x family features two independent
channels of linear predictive coding (LPC), which synthesize high-quality speech at a low data rate. Pulse-code
modulation (PCM) can produce music or sound effects. LPC and PCM can be added together to produce a
composite result. For more information, see the MSP50x3x User’s Guide (literature number SPSU006).
Table 1. MSP50x3x Family
DEVICE
AMOUNT OF ROM/PROM
FEATURES
MSP50C32
16K bytes mask ROM
9/10 I/O lines
MSP50C33
32K bytes mask ROM
9/10 I/O lines
MSP50C34
64K bytes mask ROM
9/10 I/O lines, 24 I/O lines in die form
MSP50P34
64K bytes PROM
9/10 I/O lines
MSP50C37
16K bytes mask ROM
18 I/O lines, A/D converter/analog amplifier
MSP50P37
16K bytes PROM
18 I/O lines, A/D converter/analog amplifier
Copyright
1998, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
N PACKAGE
(TOP VIEW)
OSC IN
PA6
PA5
PA4
PA3
PA2
PA1
PB1/OSC OUT
PA7
PB0
PA0
DAC +
DAC –
VDD
VSS
INIT
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MSP50P34NEIA WAF | 制造商:Texas Instruments 功能描述: |
| MSP50P37 | 制造商:TI 制造商全称:Texas Instruments 功能描述:MIXED-SIGNAL PROCESSORS |
| MSP50P37BDW | 制造商:Texas Instruments 功能描述: |
| MSP50P37N | 制造商:TI 制造商全称:Texas Instruments 功能描述:MIXED-SIGNAL PROCESSORS |
| MSP-5-19 | 功能描述:SUPT POST MINI .18"DIA FR 5/16" RoHS:是 类别:硬件，紧固件，配件 >> 电路板支座 系列:MSP 标准包装:1,000 系列:REHCBS 保持类型:卡入式锁定 长度:1.590"（40.39mm） 板间高度:1.250"（31.75mm）1 1/4" 安装类型:铆钉 材质:尼龙 支撑孔直径:0.158"（4.00mm） 支撑面板厚度:0.070"（1.78mm） 安装孔直径:0.187"（4.75mm）3/16" 安装面板厚度:0.047 ~ 0.105"（1.20 ~ 2.67mm） 其它名称:61063012REHCBS2001 |
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