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参数资料
| 型号： | MSP6126 |
| 厂商： | MICROSEMI CORP-SCOTTSDALE |
| 元件分类： | TVS二极管 - 瞬态电压抑制 |
| 英文描述： | 500 W, BIDIRECTIONAL, SILICON, TVS DIODE |
| 封装： | HERMETIC SEALED, GLASS, E, 2 PIN |
| 文件页数： | 4/4页 |
| 文件大小： | 528K |
| 代理商： | MSP6126 |
Voidless-Hermetically-Sealed Bidirectional
Transient Suppressors
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 4
Copyright
2004
1-05-2004 REV B
W
.Mi
cr
os
em
i
.C
O
M
SCOTTSD A L E DIVISION
1N6102 thru 1N6137A
and 1N6138 thru 1N6173A
1N6
102
–
1
N
6137
A
1N6
138
–
1
N
6173
A
MAXIMUM
STE
A
D
Y
-STATE
P
O
W
E
R
IN
W
A
TTS
LEAD TEMPERATURE
AMBIENT TEMPERATURE (
TA) in
oC
FIGURE 4
FIGURE 5
MAXIMUM POWER vs. LEAD TEMPERATURE
STEADY-STATE DERATING CURVE
FOR FREE-AIR MOUNTING
Maximum lead temperature in
oC (TL) at point “L” from body
(For PC boards where thermal resistance from
(for maximum operating junction temperature with equal two-lead conditions.)
mounting point to ambient is sufficiently controlled
where TOP or TJ(MAX) rating is not exceeded)
PACKAGE DIMENSIONS Inches [mm]
PACKAGE E for 1N6102 thru 1N6137A (500 W)
Note: Package E lead dimension diameter is 0.030 inch nominal with –.004 +.003 inch tolerance
PACKAGE G for 1N6138 thru 1N6173A (1500 W)
Note: Package G lead dimension diameter is 0.040 inch nominal with –.004 +.002 inch tolerance
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