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参数资料
| 型号： | MTD10N10ELT4 |
| 厂商： | MOTOROLA INC |
| 元件分类： | JFETs |
| 英文描述： | 10 A, 100 V, 0.22 ohm, N-CHANNEL, Si, POWER, MOSFET |
| 文件页数： | 3/10页 |
| 文件大小： | 252K |
| 代理商： | MTD10N10ELT4 |
MTD10N10EL
2
Motorola TMOS Power MOSFET Transistor Device Data
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain–to–Source Breakdown Voltage
(VGS = 0 Vdc, ID = 0.25 mAdc)
Temperature Coefficient (Positive)
V(BR)DSS
100
—
115
—
Vdc
mV/
°C
Zero Gate Voltage Drain Current
(VDS = 100 Vdc, VGS = 0 Vdc)
(VDS = 100 Vdc, VGS = 0 Vdc, TJ = 125°C)
IDSS
—
10
100
Adc
Gate–Body Leakage Current (VGS = ± 15 Vdc, VDS = 0 Vdc)
IGSS
—
100
nAdc
ON CHARACTERISTICS (1)
Gate Threshold Voltage
(VDS = VGS, ID = 250 Adc)
Threshold Temperature Coefficient (Negative)
VGS(th)
1.0
—
1.45
4.0
2.0
—
Vdc
mV/
°C
Static Drain–to–Source On–Resistance (VGS = 5.0 Vdc, ID = 5.0 Adc)
RDS(on)
—
0.17
0.22
Ohm
Drain–to–Source On–Voltage
(VGS = 5.0 Vdc, ID = 10 Adc)
(VGS = 5.0 Vdc, ID = 5.0 Adc, TJ = 125°C)
VDS(on)
—
1.85
—
2.6
2.3
Vdc
Forward Transconductance (VDS = 15 Vdc, ID = 5.0 Adc)
gFS
2.5
7.9
—
mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 25 Vdc, VGS = 0 Vdc,
f = 1.0 MHz)
Ciss
—
741
1040
pF
Output Capacitance
(VDS = 25 Vdc, VGS = 0 Vdc,
f = 1.0 MHz)
Coss
—
175
250
Reverse Transfer Capacitance
f = 1.0 MHz)
Crss
—
18.9
40
SWITCHING CHARACTERISTICS (2)
Turn–On Delay Time
(VDD = 50 Vdc, ID = 10 Adc,
VGS = 5.0 Vdc,
RG = 9.1 )
td(on)
—
11
20
ns
Rise Time
(VDD = 50 Vdc, ID = 10 Adc,
VGS = 5.0 Vdc,
RG = 9.1 )
tr
—
74
150
Turn–Off Delay Time
VGS = 5.0 Vdc,
RG = 9.1 )
td(off)
—
17
30
Fall Time
G = 9.1 )
tf
—
38
80
Gate Charge
(See Figure 8)
(VDS = 80 Vdc, ID = 10 Adc,
VGS = 5.0 Vdc)
QT
—
9.3
15
nC
(See Figure 8)
(VDS = 80 Vdc, ID = 10 Adc,
VGS = 5.0 Vdc)
Q1
—
2.56
—
(VDS = 80 Vdc, ID = 10 Adc,
VGS = 5.0 Vdc)
Q2
—
4.4
—
Q3
—
4.66
—
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage (1)
(IS = 10 Adc, VGS = 0 Vdc)
(IS = 10 Adc, VGS = 0 Vdc, TJ = 125°C)
VSD
—
0.98
0.898
1.6
—
Vdc
Reverse Recovery Time
(See Figure 14)
(IS = 10 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/s)
trr
—
124.7
—
ns
(See Figure 14)
(IS = 10 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/s)
ta
—
86
—
(IS = 10 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/s)
tb
—
38.7
—
Reverse Recovery Stored Charge
QRR
—
0.539
—
C
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance
(Measured from the drain lead 0.25
″ from package to center of die)
LD
—
4.5
—
nH
Internal Source Inductance
(Measured from the source lead 0.25
″ from package to source bond pad)
LS
—
7.5
—
nH
(1) Pulse Test: Pulse Width
≤ 300 s, Duty Cycle ≤ 2%.
(2) Switching characteristics are independent of operating junction temperature.
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