参数资料
型号: MTD1N80E
厂商: ON SEMICONDUCTOR
元件分类: JFETs
英文描述: 1 A, 800 V, 12 ohm, N-CHANNEL, Si, POWER, MOSFET
封装: DPAK-3
文件页数: 1/10页
文件大小: 0K
代理商: MTD1N80E
1
Motorola TMOS Power MOSFET Transistor Device Data
Designer’s
Data Sheet
TMOS EFET.
Power Field Effect Transistor
DPAK for Surface Mount
NChannel EnhancementMode Silicon Gate
This high voltage MOSFET uses an advanced termination
scheme to provide enhanced voltageblocking capability without
degrading performance over time. In addition this advanced TMOS
EFET is designed to withstand high energy in the avalanche and
commutation modes. The new energy efficient design also offers a
draintosource diode with a fast recovery time. Designed for high
voltage, high speed switching applications in power supplies,
converters and PWM motor controls, these devices are particularly
well suited for bridge circuits where diode speed and commutating
safe operating areas are critical and offer additional safety margin
against unexpected voltage transients.
Robust High Voltage Termination
Avalanche Energy Specified
SourcetoDrain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
Diode is Characterized for Use in Bridge Circuits
IDSS and VDS(on) Specified at Elevated Temperature
Surface Mount Package Available in 16 mm, 13inch/2500
Unit Tape & Reel, Add T4 Suffix to Part Number
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
DraintoSource Voltage
VDSS
800
Vdc
DraintoGate Voltage (RGS = 1.0 M)
VDGR
800
Vdc
GatetoSource Voltage — Continuous
GatetoSource Voltage — NonRepetitive (tp ≤ 10 ms)
VGS
VGSM
± 20
± 40
Vdc
Vpk
Drain Current — Continuous
Drain Current — Continuous @ 100
°C
Drain Current — Single Pulse (tp ≤ 10 s)
ID
IDM
1.0
0.8
3.0
Adc
Apk
Total Power Dissipation
Derate above 25
°C
Total Power Dissipation @ TA = 25°C, when mounted to minimum recommended pad size
PD
48
0.38
1.75
Watts
W/
°C
Watts
Operating and Storage Temperature Range
TJ, Tstg
55 to 150
°C
Single Pulse DraintoSource Avalanche Energy — Starting TJ = 25°C
(VDD = 100 Vdc, VGS = 10 Vdc, IL = 2.0 Apk, L = 10 mH, RG = 25 )
EAS
20
mJ
Thermal Resistance — Junction to Case
Thermal Resistance — Junction to Ambient
Thermal Resistance — Junction to Ambient, when mounted to minimum recommended pad size
RθJC
RθJA
2.6
100
71.4
°C/W
Maximum Temperature for Soldering Purposes, 1/8
″ from case for 10 seconds
TL
260
°C
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
EFET and Designer’s are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MTD1N80E/D
Motorola, Inc. 1995
MTD1N80E
TMOS POWER FET
1.0 AMPERES
800 VOLTS
RDS(on) = 12 OHM
Motorola Preferred Device
D
S
G
CASE 369A13, Style 2
DPAK
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MTD1N80ET4 1 A, 800 V, 12 ohm, N-CHANNEL, Si, POWER, MOSFET
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