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参数资料
| 型号： | MV6077US |
| 厂商： | MICROSEMI CORP-SCOTTSDALE |
| 元件分类： | 整流器 |
| 英文描述： | 1.3 A, SILICON, RECTIFIER DIODE |
| 封装： | HERMETIC SEALED, GLASS, E, MELF-2 |
| 文件页数： | 2/3页 |
| 文件大小： | 121K |
| 代理商： | MV6077US |
VOIDLESS HERMETICALLY SEALED
SURFACE MOUNT ULTRA FAST
RECOVERY GLASS POWER
RECTIFIERS
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 2
Copyright
2007
1-17-2007 REV C
WWW
.Microse
m
i
.CO
M
S C O T TS DALE DIVISION
1N6073US thru 1N6081US
1N6073US
─
1N6081US
ELECTRICAL CHARACTERISTICS @ 25oC unless otherwise specified
MAXIMUM
FORWARD
VOLTAGE
(PULSED)
PULSED
TEST
CURRENT
TYPE
WORKING
PEAK
REVERSE
VOLTAGE
VRWM
VF
@
IF
AVERAGE
RECTIFIED
CURRENT IO
@ TEC = 70C
AVERAGE
RECTIFIED
CURRENT IO
@ TA = 55C
MAXIMUM
REVERSE
CURRENT
IR @ VRWM
MAXIMUM
REVERSE
RECOVERY
TIME*
trr
MAXIMUM
SURGE
CURRENT
IFSM
VOLTS
AMPS
μA
ns
AMPS
1N6073US
50
2.04
9.4
3.0
0.85
1.0
30
35
1N6074US
100
2.04
9.4
3.0
0.85
1.0
30
35
1N6075US
150
2.04
9.4
3.0
0.85
1.0
30
35
1N6076US
50
1.76
18.8
6.0
1.3
5.0
30
75
1N6077US
100
1.76
18.8
6.0
1.3
5.0
30
75
1N6078US
150
1.76
18.8
6.0
1.3
5.0
30
75
1N6079US
50
1.50
37.7
12.0
2.0
10.0
30
175
1N6080US
100
1.50
37.7
12.0
2.0
10.0
30
175
1N6081US
150
1.50
37.7
12.0
2.0
10.0
30
175
*NOTE: IF = 0.5 A, IRM = 1.0 A, and IR(REC) = 0.25 A
SYMBOLS & DEFINITIONS
Symbol
Definition
VBR
Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current.
VRWM
Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating
temperature range.
VF
Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.
IR
Maximum Leakage Current: The maximum leakage current that will flow at the specified voltage and
temperature.
trr
Reverse Recovery Time: The time interval between the instant the current passes through zero when
changing from the forward direction to the reverse direction and a specified recovery decay point after a peak
reverse current is reached.
PACKAGE DIMENSIONS
PACKAGE A (1N6073US thru 1N6075US)
NOTE: This Package Outline has also previously
PAD LAYOUT
been identified as “D-5A”
INCHES
mm
A
0.246
6.25
B
0.067
1.70
C
0.105
2.67
Note: If mounting requires adhesive
separate from the solder, an additional
0.060 inch diameter contact may be
placed in the center between the pads
as an optional spot for cement.
INCHES
mm
MIN
MAX
MIN
MAX
BD
.097
.103
2.46
2.62
BL
.185
.200
4.70
5.08
ECT
.019
.028
0.48
0.71
S
.003
---
0.08
---
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