参数资料
型号: MX7534KN+
厂商: Maxim Integrated Products
文件页数: 15/16页
文件大小: 0K
描述: IC DAC 14BIT MPU COMP 20-DIP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 18
设置时间: 800ns
位数: 14
数据接口: 并联
转换器数目: 1
电压电源: 单电源
工作温度: 0°C ~ 70°C
安装类型: 通孔
封装/外壳: 20-DIP(0.300",7.62mm)
供应商设备封装: 20-PDIP
包装: 管件
输出数目和类型: 1 电流,单极;1 电流,双极
采样率(每秒): *
MX7534/MX7535
Grounding Considerations
Since IOUT and the output amplifier noninverting input
are sensitive to offset voltages, connect nodes that
must be grounded directly to a single-point ground
through a separate, very-low-resistance path. Note that
the output currents at IOUT and AGNDF vary with input
code and create code-dependent error if these termi-
nals are connected to ground (or a virtual ground)
through a resistive path.
To obtain high accuracy, it is important to use a proper
grounding technique. The two AGND pins (AGNDF
AGNDS) provide flexibility in this respect. In Figures 4a
and 4b, AGNDS and AGNDF are shorted together
externally and an extra op amp, A2, is not used.
Voltage-drops due to bond-wire resistance are not
compensated for in this circuit; this could create a lin-
earity error of approximately 0.1LSB due to bond-wire
resistance alone. This can be eliminated by using the
circuits shown in Figures 6a and 6b, where A2 main-
tains AGNDS at signal ground potential. By using
force/sense techniques, all switch contacts on the DAC
are kept at exactly the same potential, and any error
caused by bond-wire resistance is eliminated.
Figure 7 shows a remote voltage reference driving the
MX7535. Op amps A2 and A3 compensate for voltage
drops along the reference input line and analog
ground line.
Figure 8 shows a printed circuit board (PCB) layout with
a single output amplifier for the MX7534. The input to
REF (Pin 1) is shielded to reduce AC feedthrough, while
the digital inputs are shielded to minimize digital
feedthrough. The traces connecting IOUT and AGNDS
to the inverting and noninverting op amp inputs are
kept as short as possible. Gain trim components, R3
and R4, are omitted.
Zero-Offset Adjustment
(Figures 6a and 6b)
1) Load DAC register with all 0s.
2) Adjust offset of amplifier A2 for minimum potential at
AGNDS. This potential should be
≤30V with respect
to signal ground.
3) Adjust A1’s offset so that VOUT is at a minimum
(i.e.,
≤30V).
Microprocessor-Compatible,
14-Bit DACs
8
_______________________________________________________________________________________
Table 2. Unipolar Binary Code Table
BINARY NUMBER IN
DAC REGISTER
ANALOG OUTPUT
(VOUT)
MSB
LSB
11
1111
10
0000
00
0000
0001
00
0000
-VIN
(16383 )
16384
-VIN
( 8192 ) = -
1
VIN
16384
2
-VIN
( 1 )
16384
0V
R1
100
R2
33
INPUT
DATA
ANALOG
GROUND
A0
A1
7–14
CS
WR
16
620
5
4
3
2
19
1
C1
33pF
VDD
VIN
VSS
MX7534
REF
RFB
IOUT
AGNDS
AGNDF
DGND
D7–D0
15
18
17
VO
R1
20
R2
10
INPUT
DATA
ANALOG
GROUND
LDAC
A1
CSMSB
8–21
CSLSB
WR
23
727
6
5
4
3
226
1
C1
33pF
VDD
VIN
VSS
MX7535
REFF
REFS
RFB
IOUT
AGNDS
AGNDF
DGND
D13–DO
22
25
24
VO
Figure 4a. Unipolar Binary Operation
Figure 4b. Unipolar Binary Operation
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MX7534KN+ 功能描述:数模转换器- DAC 14-Bit Precision DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube
MX7534KP 功能描述:数模转换器- DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube
MX7534KP+ 功能描述:数模转换器- DAC 14-Bit Precision DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube
MX7534KP+T 功能描述:数模转换器- DAC 14-Bit Precision DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube
MX7534KP-T 功能描述:数模转换器- DAC RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube