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参数资料
| 型号： | MX884HTTR |
| 厂商： | IXYS |
| 文件页数： | 6/6页 |
| 文件大小： | 620K |
| 描述： | IC CURRENT MONITOR TSOT23-6 |
| 标准包装： | 3,000 |
| 功能： | 电流监控器 |
| 检测方法： | 高端 |
| 输入电压： | 3 V ~ 60 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-6 细型，TSOT-23-6 |
| 供应商设备封装： | TSOT-23-6 |
| 包装： | 带卷 (TR) |
INTEGRATED CIRCUITS DIVISION
MX884
6
www.ixysic.com
R01
3.4 Mechanical Dimensions
3.4.1 TSOT23-6 Package
3.4.2 Tape & Reel Dimensions
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
Recommended PCB Land Pattern
2.60 / 3.00
(0.102 / 0.118)
0.10 / 0.25
(0.004 / 0.010)
0.37 MIN
(0.015 MIN)
2.80 / 3.00
(0.110 / 0.118)
0.75 / 0.90
(0.030 / 0.035)
0.95 BSC
(0.037 BSC)
1.50 / 1.70
(0.059 / 0.067)
0.35 / 0.51
(0.014 / 0.020)
0.00 / 0.10
(0.000 / 0.004)
0.70 / 0.80
(0.028 / 0.031)
1.90 BSC
(0.095 BSC)
0.60 REF
(0.0236 REF)
0.25 BSC
(0.0098 BSC)
0.10 MIN
(0.004 MIN)
5?NOM
7?NOM
0?/ 8?/DIV>
1
6
1.05
(0.041)
2.70
(0.106)
0.95
(0.037)
0.60
(0.024)
Notes: (Unless otherwise specified)
1. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed 0.10mm
(0.004 inches) per side.
2. Dimension E does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0.15mm (0.006 inches) per side.
3. Package top may be smaller than package bottom. Dimensions D and E1 are determined at the outermost extreme of the plastic body
excluding mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between top and bottom of the plastic body.
OTES:
. 10 sprocket hole pitch cumulative tolerance ?.2
. Camber not to exceed 1mm in 100mm
. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole
. .R. hm . m n
rf
l ri r i ivi
f h
rri r
.
Dimensions
mm
(inches)
Embossment
mbossed Carrier
Top Cover
Tape Thickness
0.066 MAX.
(0.003 MAX.)
178 DIA.
(7.01 DIA.)
K
0
=1.956 MAX.
(0.077 MAX.)
P=4.0 ?0.1
(0.157 ?0.004)
A
O
=3.2 ?0.1
(0.126 ?0.004)
B
O
=3.2 ?0.1
(0.126 ?0.004)
W=8.0 ?0.2
(0.315 ?0.008)
P=4.0 ?0.1
(0.157 ?0.004)
2.0 ?0.05
(0.079 ?0.002)
1.75 ?0.1
(0.069 ?0.004)
?.5 ?0.1
(0.059 ?0.004)
3.5 ?0.05
(0.138 ?0.002)
?.1 ?0.1
(0.043 ?0.004)
Specification: DS-MX884-R01
〤opyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
or additional information please visit www.ixysic.com
XYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and
eserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed
r implied. Except as set forth in IXYS Integrated Circuits Divisions Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability
hatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a
articular purpose, or infringement of any intellectual property right.
he products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
he body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Divisions product may result in direct physical
arm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes
o its products at any time without notice.
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