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参数资料
| 型号： | NAND512W3A2CV6F |
| 元件分类： | 开关 |
| 英文描述： | TOGGLE SWITCH, DP3T, MOMENTARY, 4A, 28VDC, PANEL MOUNT-THREADED |
| 文件页数： | 7/7页 |
| 文件大小： | 525K |
| 代理商： | NAND512W3A2CV6F |
A-84
APEM
www.apem.com
12000X778 series
High performance toggle switches - threaded bushing 11,9 (15/32)
A
FLUORESCENT TIP
X778
Blank
None
0.38
White fluorescent tip.
Becomes luminous when submitted to ultra-violet rays.
Standard lever
Locking lever
LEVERS
/ LOCKING LEVERS
Locking levers
Levers
Standard (leave blank)
-12
Short lever
Dash compulsory before lever code.
Sealing boots : see section H.
Security caps : see section I.
-1V
1 locked position (function 6)
Typical angle of throw : 26°
Consult factory for other locking lever options.
-2V
2 locked positions (function 6)
Typical angle of throw : 26°
-3V
3 locked positions (functions 9 and 4)
Typical angle of throw : 20°
Flat
AGENCY APPROVAL
C
CEEC
CC
C
CECC 96201-005 and CECC 96201-008
Availability
: consult factory for details of approved models.
Marking
: to order switches marked CECC, please complete above box with "CECC".
Blank : no agency approval required.
X778
(.
4
6
4
)
(.196 DIA)
5.00
1
.8
0
(.
4
6
8
)
1
.9
0
(.
4
6
8
)
(.
7
6
3
)
1
.9
0
1
9
.4
0
(.275 D
IA)
7.00
(.275 D
IA)
1
.9
0
(.
4
6
8
)
1
9
.4
0
(.
7
6
3
)
(.
4
6
8
)
1
.9
0
(.
8
1
)
2
0
.6
0
(.275)
7.00
1
.9
0
(.
4
6
8
)
(.
6
8
1
)
(.236 DIA)
1
7
.3
0
6.00
相关PDF资料 |
PDF描述 |
|---|---|
| NAND512W4A0AN1F | TOGGLE SWITCH, DP3T, MOMENTARY, 4A, 28VDC, PANEL MOUNT-THREADED |
| NAND512W4A0AN1T | TOGGLE SWITCH, DP3T, MOMENTARY, 4A, 28VDC, PANEL MOUNT-THREADED |
| NAND512W4A0AN6E | TOGGLE SWITCH, DP3T, MOMENTARY, 4A, 28VDC, PANEL MOUNT-THREADED |
| NAND512W4A0AN6F | TOGGLE SWITCH, DP3T, MOMENTARY, 4A, 28VDC, PANEL MOUNT-THREADED |
| NAND512W4A0AN6T | TOGGLE SWITCH, DP3T, MOMENTARY, 4A, 28VDC, PANEL MOUNT-THREADED |
相关代理商/技术参数 |
参数描述 |
|---|---|
| NAND512W3A2CZA6E | 功能描述:IC FLASH 512MBIT 63VFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 产品变化通告:Product Discontinuation 26/Apr/2010 标准包装:136 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步，DDR II 存储容量:18M（1M x 18） 速度:200MHz 接口:并联 电源电压:1.7 V ~ 1.9 V 工作温度:0°C ~ 70°C 封装/外壳:165-TBGA 供应商设备封装:165-CABGA（13x15） 包装:托盘 其它名称:71P71804S200BQ |
| NAND512W3A2DDI6 | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
| NAND512W3A2DN6E | 功能描述:IC FLASH 512MBIT 48TSOP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.173"，4.40mm 宽） 供应商设备封装:8-MFP 包装:带卷 (TR) |
| NAND512W3A2DZA6E | 功能描述:IC FLASH 512MBIT 63VFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.173"，4.40mm 宽） 供应商设备封装:8-MFP 包装:带卷 (TR) |
| NAND512W3A2SE06 | 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film |
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