参数资料
| 型号： | NB7L216MNG |
| 厂商： | ON Semiconductor |
| 文件页数： | 5/11页 |
| 文件大小： | 0K |
| 描述： | IC RECEIVER/DRIVER DIFF 16-QFN |
| 标准包装： | 123 |
| 逻辑类型： | 差分接收器/驱动器 |
| 电源电压： | 2.375 V ~ 3.465 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VFQFN 裸露焊盘 |
| 供应商设备封装： | 16-QFN（3x3） |
| 包装： | 管件 |
NB7L216
http://onsemi.com
3
Table 2. ATTRIBUTES
Characteristics
Value
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 500 V
> 10 V
> 4 kV
Moisture Sensitivity (Note 2)
Pb Pkg
PbFree Pkg
QFN16
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
Transistor Count
164
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test.
2. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS (Note 3)
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
Positive Power Supply
VEE = 0 V
3.6
V
VEE
Negative Power Supply
VCC = 0 V
3.6
V
VI
Positive Input
Negative Input
VEE = 0 V
VCC = 0 V
VI = VCC
VI = VEE
3.6
V
VINPP
Differential Input Voltage
|D D|
2.8
V
IIN
Input Current Through RT (50 W Resistor)
Static
Surge
45
80
mA
IOUT
Output Current
Continuous
Surge
25
50
mA
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
40 to +85
°C
Tstg
Storage Temperature Range
65 to +150
°C
qJA
Thermal Resistance (JunctiontoAmbient)
(Note 4)
0 lfpm
500 lfpm
QFN16
42
35
°C/W
qJC
Thermal Resistance (JunctiontoCase)
1S2P (Note 4)
QFN16
4
°C/W
Tsol
Wave Solder
Pb
PbFree
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously.
If stress limits are exceeded device functional operation is not implied, damage may occur and reliability may be affected.
4. JEDEC standard multilayer board 1S2P (1 signal, 2 power) with 8 filled thermal vias under exposed pad.
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