参数资料
型号: NBSG16BA
厂商: ON Semiconductor
文件页数: 5/12页
文件大小: 0K
描述: IC RCVR/DRVR RSECL SIGE 16FCBGA
产品变化通告: Product Discontinuation 21/Jun/2007
标准包装: 100
类型: 收发器
应用: 仪表
安装类型: 表面贴装
封装/外壳: 16-LBGA,FCBGA
供应商设备封装: 16-FCBGA(4x4)
包装: 管件
其它名称: NBSG16BAOS
NBSG16
http://onsemi.com
2
Figure 1. BGA16 Pinout (Top View)
VEE
D
VTD
VEE
VBB
VTD
NC
VEE
VCC
VMM
VEE
Q
A
B
C
D
12
3
4
VEE NC
NC VEE
VEE VBB VMM VEE
VCC
Q
VCC
VTD
D
VTD
56
7
8
16
15
14
13
12
11
10
9
1
2
3
4
NBSG16
Exposed Pad (EP)
Figure 2. QFN16 Pinout (Top View)
Table 1. PIN DESCRIPTION
Pin
Name
I/O
Description
BGA
QFN
C2
1
VTD
Internal 50 W Termination Pin. See Table 2.
C1
2
D
ECL, CML,
LVCMOS, LVDS,
LVTTL Input
Inverted Differential Input. Internal 75 kW to VEE and 36.5 kW to VCC.
B1
3
D
ECL, CML,
LVCMOS, LVDS,
LVTTL Input
Noninverted differential input. Internal 75 kW to VEE
B2
4
VTD
Internal 50 W Termination Pin. See Table 2.
A1,D1,A4,
D4
5,8,13,16
VEE
Negative Supply Voltage
A2,A3
6,7
NC
No Connect
B3,C3
9,12
VCC
Positive Supply Voltage
B4
10
Q
RSECL Output
Noninverted Differential Output. Typically Terminated with 50 W to
VTT = VCC 2 V
C4
11
Q
RSECL Output
Inverted Differential Output. Typically Terminated with 50 W to VTT = VCC 2 V
D3
14
VMM
LVCMOS Reference Voltage Output. (VCC VEE)/2
D2
15
VBB
ECL Reference Voltage Output
N/A
EP
The Exposed Pad (EP) and the QFN16 package bottom is thermally connected
to the die for improved heat transfer out of package. The exposed pad must be
attached to a heatsinking conduit. The pad is not electrically connected to the
die but may be electrically and thermally connected to VEE on the PC board.
1. The NC pins are electrically connected to the die and MUST be left open.
2. All VCC and VEE pins must be externally connected to Power Supply to guarantee proper operation. The thermally exposed pad on package
bottom (see case drawing) must be attached to a heatsinking conduit.
3. In the differential configuration when the input termination pins (VTD, VTD) are connected to a common termination voltage, and if no signal
is applied then the device will be susceptible to selfoscillation.
相关PDF资料
PDF描述
EMC43DRAS-S734 CONN EDGECARD 86POS .100 R/A PCB
GSC65DRTN-S13 CONN EDGECARD 130PS .100 EXTEND
GMC65DRTN-S13 CONN EDGECARD 130POS .100 EXTEND
GSC65DRTH-S13 CONN EDGECARD 130PS .100 EXTEND
GMC65DRTH-S13 CONN EDGECARD 130POS .100 EXTEND
相关代理商/技术参数
参数描述
NBSG16BAEVB 功能描述:BOARD EVALUATION BBG NBSG16BA RoHS:否 类别:编程器,开发系统 >> 过时/停产零件编号 系列:- 标准包装:1 系列:- 传感器类型:CMOS 成像,彩色(RGB) 传感范围:WVGA 接口:I²C 灵敏度:60 fps 电源电压:5.7 V ~ 6.3 V 嵌入式:否 已供物品:成像器板 已用 IC / 零件:KAC-00401 相关产品:4H2099-ND - SENSOR IMAGE WVGA COLOR 48-PQFP4H2094-ND - SENSOR IMAGE WVGA MONO 48-PQFP
NBSG16BAHTBG 功能描述:时钟驱动器及分配 BBG 2.5/3.3V SIGE DIF/RCV RoHS:否 制造商:Micrel 乘法/除法因子:1:4 输出类型:Differential 最大输出频率:4.2 GHz 电源电压-最大: 电源电压-最小:5 V 最大工作温度:+ 85 C 封装 / 箱体:SOIC-8 封装:Reel
NBSG16BAR2 功能描述:缓冲器和线路驱动器 2.5V/3.3V SiGe Diff RoHS:否 制造商:Micrel 输入线路数量:1 输出线路数量:2 极性:Non-Inverting 电源电压-最大:+/- 5.5 V 电源电压-最小:+/- 2.37 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Reel
NBSG16M 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:2.5V/3.3VMultilevel Input to CML Clock/Data Receiver/Driver/Translator Buffer
NBSG16M/D 制造商:未知厂家 制造商全称:未知厂家 功能描述:2.5V/3.3V SiGe Differential CML Receiver/Driver