参数资料
| 型号： | NC7SZ66P5 |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 3/8页 |
| 文件大小： | 0K |
| 描述： | IC BUS SWITCH SGL SPST SC70-5 |
| 产品变化通告： | Mold Compound Change 12/Dec/2007 |
| 标准包装： | 250 |
| 系列： | 7SZ |
| 类型： | 总线开关 |
| 电路： | 1 x 1:1 |
| 独立电路： | 1 |
| 电压电源： | 单电源 |
| 电源电压： | 1.65 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-TSSOP（5 引线），SC-88A，SOT-353 |
| 供应商设备封装： | SC-70-5 |
| 包装： | 带卷 (TR) |
3
SY58011U
Micrel, Inc.
M9999-110311
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(Note 1)
Power Supply Voltage (VCC) .......................–0.5V to +4.0V
Input Voltage (VIN) .........................................–0.5V to VCC
CML Output Voltage (VOUT) ...........VCC–1.0V to VCC+0.5V
Current (VT)
Source or sink current on VT pin........................ ±100mA
Input Current
Source or sink current on IN, /IN ......................... ±50mA
Current (VREF)
Source or sink current on VREF-AC, Note 4 ....... ±1.5mA
Lead Temperature Soldering, (20 seconds) ............. 260°C
Storage Temperature Range (TSTORE) ... –65°C to +150°C
Operating Ratings(Note 2)
Supply Voltage (VCC) ............................+2.375V to +3.60V
Operating Temperature Range (TA) .......... –40°C to +85°C
Package Thermal Resistance, Note 3
QFN
(θJA)
Still-Air ............................................................ 60°C/W
500lfpm ........................................................... 54°C/W
QFN
(ψJB)........................................................... 33°C/W
TA= –40°C to +85°C
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply Voltage
2.375
3.60
V
ICC
Power Supply Current
Max. VCC, no load
75
95
mA
VIH
Input HIGH Voltage
IN, /IN, Note 6
VCC–1.6
VCC
V
VIL
Input LOW Voltage
IN, /IN
0
VIH–0.1
V
VIN
Input Voltage Swing
see Figure 1a.
0.1
1.7
V
VDIFF_IN
Differential Input Voltage Swing
see Figure 1b.
0.2
V
RIN
Into VT Resistance
40
50
60
VREF-AC
Output Reference Voltage
VCC –1.3
VCC –1.2
VCC –1.1
V
IN to VT
1.28
V
DC ELECTRICAL CHARACTERISTICS(Note 5)
VCC = 3.3V ±10% or 2.5V ±5%; TA = –40°C to +85°C; RL = 100 across each output pair, or equivalent, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VOH
Output HIGH Voltage
Q0, /Q0, Q1, /Q1
VCC –0.020 VCC –0.010
VCC
V
VOUT
Output Voltage Swing
Q0, /Q0, Q1, /Q1; see Figure 1a.
325
400
mV
VDIFF_OUT
Differential Output Voltage Swing
Q0, /Q0, Q1, /Q1; see Figure 1b.
650
800
mV
ROUT
Output Source Impedance
Q0, /Q0, Q1, /Q1
40
50
60
ohms
Notes:
1.
Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for
extended periods may affect device reliability.
2.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3.
Thermal performance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential (gnd) on the pcb.
4.
Due to the limited drive capability, use for input of the same package only.
5.
The circuit is designed to meet the dc specifications shown in the above table after thermal equilibrium has been established.
6.
VIH (min) not lower than 1.2V.
CML DC ELECTRICAL CHARACTERISTICS(Note 5)
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