参数资料
型号: NC7WZ08L8X
厂商: Fairchild Semiconductor
文件页数: 9/10页
文件大小: 0K
描述: IC GATE AND UHS DUAL 2IN 8MCRPAK
产品变化通告: Die Material, Mold Compound Change 03/Oct/2008
标准包装: 1
系列: 7WZ
逻辑类型: 与门
电路数: 2
输入数: 2
电源电压: 1.65 V ~ 5.5 V
电流 - 静态(最大值): 1µA
输出电流高,低: 32mA,32mA
额定电压和最大 CL 时的最大传播延迟: 3.7ns @ 5V,50pF
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
供应商设备封装: 8-MicroPak?
封装/外壳: 8-XFQFN
包装: 标准包装
其它名称: NC7WZ08L8XFSDKR
2000 Fairchild Semiconductor Corporation
www.fairchildsemi.com
NC7WZ08 Rev. 1.11.0
8
NC7WZ08
Tin
yLogic
UHS
Dual
2-Input
AND
Gate
Physical Dimensions
Figure 4. 8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specications do not expand the terms of Fairchild’s worldwide terms and conditions,
specically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
0.30 TYP
SEATING PLANE
0.10-0.18
0.13
A B
C
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
D. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M, 1982.
AND TIE BAR EXTRUSIONS.
MAB08AREVC
0.50TYP
B. DIMENSIONS ARE IN MILLIMETERS.
A. CONFORMS TO JEDEC REGISTRATION MO-187
-C-
0.17-0.27
0.10
0.00
DETAIL A
0°-8°
0.4 TYP
-B-
0.70±0.10
ALL LEAD TIPS
0.2 C B A
3.1±.1
0.15
PIN #1 IDENT.
0.90 MAX
ALL LEAD TIPS
0.1 C
1.55
8
1
4
2.3±0.1
5
-A-
0.70
2.70
3.40
1.00
0.5 TYP
DETAIL A
1.80
GAGE PLANE
0.12
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