参数资料
型号: NCP1288BD65R2G
厂商: ON Semiconductor
文件页数: 4/39页
文件大小: 0K
描述: IC REG CTRLR FLYBACK PWM 7SOIC
标准包装: 1
PWM 型: 电流模式
输出数: 1
频率 - 最大: 70kHz
占空比: 85%
电源电压: 10.5 V ~ 28 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 125°C
封装/外壳: 8-SOIC(0.154",3.90mm 宽)7 引线
包装: 标准包装
其它名称: NCP1288BD65R2GOSDKR
NCP1288
MAXIMUM RATINGS
Rating
Supply Pin (pin 6) (Note 1)
Voltage range
Current range
High Voltage Pin (pin 8) (Note 1)
Voltage range
Current range
Driver Pin (pin 5) (Note 1)
Voltage range
Current range
All other pins (Note 1)
Voltage range
Current range
Thermal Resistance
Junction ? to ? Air, low conductivity PCB (Note 2)
Junction ? to ? Air, medium conductivity PCB (Note 3)
Junction ? to ? Air, high conductivity PCB (Note 4)
Temperature Range
Operating Junction Temperature
Storage Temperature Range
ESD Capability
Human Body Model (HBM) per JEDEC standard JESD22, Method A114E (All pins except HV)
Machine Model (MM) per JEDEC standard JESD22, Method A115A
Symbol
V CCMAX
I CCMAX
V HVMAX
I HVMAX
V DRVMAX
I DRVMAX
V MAX
I MAX
R q JA
T JMAX
T STRGMAX
Value
–0.3 to 28
$ 30
–0.3 to 500
$ 20
–0.3 to 20
$ 1500
–0.3 to 10
$ 10
162
147
125
? 40 to +150
? 60 to +150
2000
200
Unit
V
mA
V
mA
V
mA
V
mA
° C/W
° C
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device contains latch ? up protection and exceeds 100 mA per JEDEC Standard JESD78
2. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 100 mm 2 of 1 oz copper traces and heat spreading area. As specified
for a JEDEC 51 ? 1 conductivity test PCB. Test conditions were under natural convection or zero air flow.
3. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 100 mm 2 of 2 oz copper traces and heat spreading area. As specified
for a JEDEC 51 ? 2 conductivity test PCB. Test conditions were under natural convection or zero air flow.
4. As mounted on a 80 x 100 x 1.5 mm FR4 substrate with a single layer of 650 mm 2 of 1 oz copper traces and heat spreading area. As specified
for a JEDEC 51 ? 3 conductivity test PCB. Test conditions were under natural convection or zero air flow.
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