- 您现在的位置：买卖IC网 > PDF目录17368 > NCP1597BGEVB (ON Semiconductor)BOARD EVALUATION NCP1597B PDF资料下载
参数资料
| 型号： | NCP1597BGEVB |
| 厂商： | ON Semiconductor |
| 文件页数： | 12/13页 |
| 文件大小： | 0K |
| 描述： | BOARD EVALUATION NCP1597B |
| 设计资源： | NCP1597BEVB Schematic NCP1597B |
| 标准包装： | 1 |
| 主要目的： | DC/DC，步降 |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 最低可调至 0.8V |
| 电流 - 输出： | 2A |
| 输入电压： | 4 ~ 5.5 V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 1MHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | NCP1597B |
| 其它名称： | NCP1597BGEVBOS |
NCP1597B
P HSON + I
R DS(on)HS
(eq. 8)
maximum ambient temperature. Calculate the power lost in
the NCP1597B using the following equations:
1. High side MOSFET
The conduction loss in the top switch is:
2
RMS_HSFET
Where:
T J + T C ) P TOTAL @ q JC (eq. 15)
q JC is the junction ? to ? case thermal resistance equal to
1.7 ° C/W. T C is the temperature of the case and TJ is the
junction temperature, or die temperature. The
case ? to ? ambient thermal resistance is dependent on how
well heat can be transferred from the PC board to the air.
Solder the underside ? exposed pad to a large copper GND
I RMS_FET +
I out 2 )
D I PP
12
2
D
(eq. 9)
plane. If the die temperature reaches the thermal shutdown
threshold the NCP1597B shut down and does not restart
again until the die temperature cools by 30 ° C.
P HSSW +
D I PP is the peak ? to ? peak inductor current ripple.
The power lost due to switching the internal power high side
MOSFET is:
V in @ I out @ t r ) t f @ f SW (eq. 10)
2
t r and t f are the rise and fall times of the internal power
MOSFET measured at SW node.
2. Low side MOSFET
The power dissipated in the top switch is:
Layout
As with all high frequency switchers, when considering
layout, care must be taken in order to achieve optimal
electrical, thermal and noise performance. To prevent noise
both radiated and conducted, the high speed switching
current path must be kept as short as possible. Shortening the
current path will also reduce the parasitic trace inductance
of approximately 25 nH/inch. At switch off, this parasitic
inductance produces a flyback spike across the NCP1597B
switch. When operating at higher currents and input
voltages, with poor layout, this spike can generate voltages
Where:
P LSON + I RMS_LSFET 2 @ R DS(on)LS
(eq. 11)
across the NCP1597B that may exceed its absolute
maximum rating. A ground plane should always be used
under the switcher circuitry to prevent interplane coupling
I RMS_LSFET +
I out 2 )
D I PP
12
2
@ (1 * D)
(eq. 12)
and overall noise.
The FB component should be kept as far away as possible
from the switch node. The ground for these components
D I PP is the peak ? to ? peak inductor current ripple.
The switching loss for the low side MOSFET can be
ignored.
The power lost due to the quiescent current (I Q ) of the device
is:
P Q + V in @ I Q (eq. 13)
I Q is the switching quiescent current of the NCP1597B.
P TOTAL + P HSON ) P HSSW ) P LSON ) P Q (eq. 14)
Calculate the temperature rise of the die using the following
equation:
should be separated from the switch current path. Failure to
do so will result in poor stability or subharmonic like
oscillation.
Board layout also has a significant effect on thermal
resistance. Reducing the thermal resistance from the ground
pin and exposed pad onto the board will reduce die
temperature and increase the power capability of the
NCP1597B. This is achieved by providing as much copper
area as possible around the exposed pad. Adding multiple
thermal vias under and around this pad to an internal ground
plane will also help. Similar treatment to the inductor pads
will reduce any additional heating effects.
http://onsemi.com
12
相关PDF资料 |
PDF描述 |
|---|---|
| MIC2545A-1BM | IC SW CURR LIMIT HI SIDE 8-SOP |
| NCP1597AGEVB | BOARD EVALUATION NCP1597A |
| A9CAA-0305F | FLEX CABLE - AFG03A/AF03/AFE03T |
| MIC2506BM | IC SW HIGH SIDE DUAL 1A 8SOIC |
| NCP3011GEVB | BOARD EVAL NCP3011 BUCK CTLR |
相关代理商/技术参数 |
参数描述 |
|---|---|
| NCP1597BMNTWG | 功能描述:直流/直流开关调节器 SYNC BUCK CONTROLLER RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5 |
| NCP1599GEVB | 功能描述:电源管理IC开发工具 NCP1599 EVB RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| NCP1599MNTWG | 功能描述:直流/直流开关转换器 SYNC BUCK CONTROLLER RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
| NCP15WB333E03RC | 制造商:Murata Manufacturing Co Ltd 功能描述:LEADED NTC THERMISTOR |
| NCP15WB333J03RC | 功能描述:热敏电阻 - NTC 33K OHM 5% RoHS:否 制造商:EPCOS 电阻:10 kOhms 功率额定值:150 mW 容差:2 % 端接类型:Radial 系列:B57703M 工作温度范围:- 55 C to + 125 C |
发布紧急采购，3分钟左右您将得到回复。