参数资料
型号: NCP1653EVB
厂商: ON Semiconductor
文件页数: 18/19页
文件大小: 0K
描述: BOARD EVAL FOR NCP1653
设计资源: NCP1653EVB Schematic
NCP1653EVB Gerber Files
NCP1653EVB Bill of Materials
标准包装: 1
主要目的: 电源管理,功率因数校正
嵌入式:
已用 IC / 零件: NCP1653
已供物品:
NCP1653, NCP1653A
ORDERING INFORMATION
Device
NCP1653PG
NCP1653DR2G
NCP1653APG
NCP1653ADR2G
Package
PDIP ? 8
(Pb ? Free)
SO ? 8
(Pb ? Free)
PDIP ? 8
(Pb ? Free)
SO ? 8
(Pb ? Free)
Shipping ?
50 Units / Rail
2500 Units / Tape & Reel
50 Units / Rail
2500 Units / Tape & Reel
Switching Frequency
100 kHz
67 kHz
?For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
PACKAGE DIMENSIONS
PDIP ? 8
P SUFFIX
CASE 626 ? 05
ISSUE N
NOTE 8
A1
D1
8
1
e/2
e
D
TOP VIEW
5
4
b2
A
E1
B
A2
A
L
8X b
H
NOTE 3
SEATING
PLANE
C
E
c
END VIEW
WITH LEADS CONSTRAINED
NOTE 5
M
eB
END VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS ? 3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT
TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
INCHES
MILLIMETERS
DIM
MIN MAX
MIN MAX
???? 0.210
??? 5.33
A
0.015 ????
0.38 ???
A1
0.115 0.195
2.92 4.95
A2
0.014 0.022
0.35 0.56
b
0.060 TYP
1.52 TYP
b2
0.008 0.014
0.20 0.36
C
0.355 0.400
9.02 10.16
D
0.005 ????
0.13 ???
D1
0.300 0.325
7.62 8.26
E
0.240 0.280
6.10 7.11
E1
0.100 BSC
2.54 BSC
e
???? 0.430
??? 10.92
eB
0.115 0.150
2.92 3.81
L
???? 10 °
??? 10 °
M
SIDE VIEW
0.010
M
C A
M
B
M
NOTE 6
http://onsemi.com
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