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参数资料
| 型号： | NCP18XH103F03RB |
| 厂商： | Murata Electronics North America |
| 文件页数： | 21/44页 |
| 文件大小： | 0K |
| 描述： | THERMISTOR 10K OHM NTC 0603 SMD |
| 产品培训模块： | NTC Thermistors and Simulator |
| 产品目录绘图： | NCP Series Side |
| 标准包装： | 1 |
| 系列： | NCP18 |
| 在 25°C 时的电阻（欧姆）： | 10k |
| 电阻公差： | ±1% |
| B 值公差： | ±1% |
| B25/50： | 3380K |
| B25/85： | 3434K |
| B25/100： | 3455K |
| 工作温度： | -40°C ~ 125°C |
| 功率 - 最大： | 100mW |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 0603（1608 公制） |
| 包装： | 标准包装 |
| 产品目录页面： | 2830 (CN2011-ZH PDF) |
| 其它名称： | 490-4800-6 |
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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
R44E.pdf
Dec.17,2012
Temperature Sensor and Compensation Chip Type ! Caution/Notice
c Notice (Soldering and Mounting)
1. Mounting Position
Choose a mounting position that minimizes the stress
imposed on the chip during flexing or bending of the
board.
Component Direction
Locate this
product
horizontal to the
direction in
which stress
acts.
Mounting Close to Board Separation Line
Perforation
C
Holes
B
Keep this product on the
A
Slit
D
PC Board away from the
Separation Line.
Worst ← A-C-B-D → Better
2. Allowable Soldering Temperature and Time
(a) Solder within the temperature and time combinations
indicated by the slanted lines in the following graphs.
(b) Excessive soldering conditions may cause dissolution of
metallization or deterioration of solder-wetting on the
external electrode.
(c) In case of repeated soldering, the accumulated soldering
time should be within the range shown in the figure
below. (For example, Reflow peak temperature: 260°C,
twice -> The total accumulated soldering time at 260°C is
within 30 seconds.)
NCP03/15 Series
Allowable Reflow Soldering Temp. and Time
280
270
260
250
240
230
220
0
10
20
30 40 50
60
70
80
90
Time (sec.)
NCP18/21 Series
Allowable Flow Soldering Temp. and Time
280
270
260
250
240
230
220
210
Allowable Reflow Soldering Temp. and Time
280
270
260
250
240
230
220
210
0
10 20
Time (sec.)
30
0 10 20 30 40 50 60 70 80 90 100 110
Time (sec.)
Continued on the following page.
19
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相关代理商/技术参数 |
参数描述 |
|---|---|
| NCP18XH103F0SRB | 功能描述:热敏电阻 - NTC 0603 10Kohms 3380K RoHS:否 制造商:EPCOS 电阻:10 kOhms 功率额定值:150 mW 容差:2 % 端接类型:Radial 系列:B57703M 工作温度范围:- 55 C to + 125 C |
| NCP18XH103J03RB | 功能描述:热敏电阻 - NTC 10K OHM 5% RoHS:否 制造商:EPCOS 电阻:10 kOhms 功率额定值:150 mW 容差:2 % 端接类型:Radial 系列:B57703M 工作温度范围:- 55 C to + 125 C |
| NCP18XH103J03RB | 制造商:Murata Manufacturing Co Ltd 功能描述:THERMISTOR SMD 10K |
| NCP18XH103J0SRB | 功能描述:热敏电阻 - NTC 10K OHM 5% RoHS:否 制造商:EPCOS 电阻:10 kOhms 功率额定值:150 mW 容差:2 % 端接类型:Radial 系列:B57703M 工作温度范围:- 55 C to + 125 C |
| NCP18XH103K03RB | 功能描述:热敏电阻 - NTC 10K OHM 10% RoHS:否 制造商:EPCOS 电阻:10 kOhms 功率额定值:150 mW 容差:2 % 端接类型:Radial 系列:B57703M 工作温度范围:- 55 C to + 125 C |
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