参数资料
型号: NCP2830MUTXG
厂商: ON Semiconductor
文件页数: 1/15页
文件大小: 0K
描述: IC AMP AUDIO CLASS D 20UQFN
产品变化通告: Product Obsolescence 24/Jan/2011
标准包装: 3,000
类型: D 类
输出类型: 1-通道(单声道)
在某负载时最大输出功率 x 通道数量: 1.2W x 1 @ 8 欧姆
电源电压: 2.7 V ~ 5.5 V
特点: 差分输入,关闭
安装类型: 表面贴装
供应商设备封装: 20-UQFN(3x3)
封装/外壳: 20-UFQFN 裸露焊盘
包装: 带卷 (TR)
Semiconductor Components Industries, LLC, 2009
August, 2009 Rev. 0
1
Publication Order Number:
NCP2830/D
NCP2830
1W Constant Filterless
Class-D Audio Amplifier
NCP2830 is a cost effective mono audio power amplifier designed
for portable communication device applications such as mobile
phones. Due to its integrated charge pump structure, this part is
capable of delivering 1 W of continuous average power to an 8.0
W
Bridge Tied Load no matter the voltage provided by a lithium/Ion
battery.
NCP2830 is a preferred solution for long playback audio with
minimum space required.
Added to a fast startup time of 200
ms and a 88dB PSRR, the
NCP2830 audio power amplifier is specifically designed to provide
high quality and level output power from low supply voltage,
requiring very few external components.
Features
1 W to 8 W load for VDD from 2.7 V up to 5.5 V
High quality audio (THD+N = 0.04%)
Low noise: SNR up to 100 dB
Very Fast Turn On Time: 200 ms
Overall system efficiency optimization: up to 89%
Superior PSRR (88 dB): Direct Connection to Battery
Very Low Quiescent Current 7 mA
Optimized PWM Output Stage: Filterless Capability
Selectable gain of 2 V/V or 4 V/V
Fully Differential Capability:
Thin QFN 3x3 mm, 20 pins
This Device uses HalogenFree Molding Compound
This is a PbFree Device
Typical Applications
Cellular Phones and Digital Cameras
Personal Digital Assistant and Portable Media Player
Audio Accessories
GPS
Figure 1. Typical Application Circuit
C3
C4
2.2 mF,
6.3 V
2.2 mF,
6.3 V
C5
C6
C1P
C1N C2P
C2N
PVDD
AVDD
WM
GS
SD
INM
INP
VB_OUT
VB_IN
OUTM
OUTP
AGND
PGND_D
RES1
PGND_CP
C1
C2
+
Battery
C7
C8
1 mF
NCP2830
Audio Inputs
Digital Control
1 mF
10 mF,
6.3 V
10 mF,
6.3 V
RES2
4.7 mF
6.3 V
4.7 mF
6.3 V
UQFN20
MU SUFFIX
CASE 523AL
See detailed ordering and shipping information in the package
dimensions section on page 14 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAM
http://onsemi.com
20
XXXX
ALYWG
G
1
XXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= PbFree Package
2
3
4
5
1
20
19
18
17
16
15
14
13
12
11
67
89
10
INP
INM
AGND
AVDD
WM
VB_IN
RES2
OUTP
PGND_D
OUTM
SD
GS
C2N
PGND_CP
C1N
VB_OUT
C1P
C2P
PVDD
RES1
(TOP VIEW)
20Pin 3 x 3 x 0.50 mm QFN
Exposed pad must be soldered to
PCB Ground Plane
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