参数资料
型号: NCP2890DMR2
厂商: ON Semiconductor
文件页数: 10/16页
文件大小: 0K
描述: IC AMP POWER AUDIO 1W 8MICRO
产品变化通告: LTB Notification 03/Jan/2008
标准包装: 1
类型: AB 类
输出类型: 1-通道(单声道)
在某负载时最大输出功率 x 通道数量: 1.08W x 1 @ 8 欧姆
电源电压: 2.2 V ~ 5.5 V
特点: 消除爆音,差分输入,短路和热保护,关闭
安装类型: 表面贴装
供应商设备封装: Micro8?
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
包装: 剪切带 (CT)
其它名称: NCP2890DMR2OSCT
NCP2890, NCV2890
http://onsemi.com
3
PIN DESCRIPTION
9Pin FlipChip
CSP
Micro8
Type
Symbol
Description
A1
4
I
INM
Negative input of the first amplifier, receives the audio input signal. Connected to
the feedback resistor Rf and to the input resistor Rin.
A2
5
O
OUTA
Negative output of the NCP2890. Connected to the load and to the feedback
resistor Rf.
A3
3
I
INP
Positive input of the first amplifier, receives the common mode voltage.
B1
NA
I
VM_P
Power Analog Ground.
B2
7
I
VM
Core Analog Ground.
B3
6
I
Vp
Positive analog supply of the cell. Range: 2.2 V5.5 V.
C1
2
I
BYPASS
Bypass capacitor pin which provides the common mode voltage (Vp/2).
C2
8
O
OUTB
Positive output of the NCP2890. Connected to the load.
C3
1
I
SHUTDOWN
The device enters in shutdown mode when a low level is applied on this pin.
MAXIMUM RATINGS (Note 1)
Rating
Symbol
Value
Unit
Supply Voltage
Vp
6.0
V
Operating Supply Voltage
Op Vp
2.2 to 5.5 V
2.0 V = Functional Only
Input Voltage
Vin
0.3 to Vcc +0.3
V
Max Output Current
Iout
500
mA
Power Dissipation (Note 2)
Pd
Internally Limited
Operating Ambient Temperature
TA
40 to +85
°C
Max Junction Temperature
TJ
150
°C
Storage Temperature Range
Tstg
65 to +150
°C
Thermal Resistance JunctiontoAir
Micro8
9Pin FlipChip CSP
RqJA
230
(Note 3)
°C/W
ESD Protection
Human Body Model (HBM) (Note 4)
Machine Model (MM) (Note 5)
8000
>250
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25°C.
2. The thermal shutdown set to 160
°C (typical) avoids irreversible damage on the device due to power dissipation. For further information see
page 10.
3. For the 9Pin FlipChip CSP package, the RqJA is highly dependent of the PCB Heatsink area. For example, RqJA can equal 195°C/W with
50 mm2 total area and also 135
°C/W with 500 mm2. For further information see page 10. The bumps have the same thermal resistance and
all need to be connected to optimize the power dissipation.
4. Human Body Model, 100 pF discharge through a 1.5 k
W resistor following specification JESD22/A114.
5. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.
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