参数资料
| 型号： | NCP347MTAITBG |
| 厂商： | ON Semiconductor |
| 文件页数： | 3/13页 |
| 文件大小： | 0K |
| 描述： | IC OVERVOLTAGE PROT CTRLR 10WDFN |
| 产品变化通告： | Product Obsolescence 01/Jul/2009 |
| 标准包装： | 3,000 |
| 电压 - 工作： | 1.2 ~ 28V |
| 电压 - 箝位： | 7V |
| 技术： | 混合技术 |
| 电路数： | 3 |
| 应用： | 通用 |
| 封装/外壳： | 10-WFDFN 裸露焊盘 |
| 供应商设备封装： | 10-WDFN（2.5x2） |
| 包装： | 带卷 (TR) |
NCP347
PIN FUNCTION DESCRIPTION
Pin No.
1
4
5
Symbol
IN
Function
POWER
Description
Input Voltage Pin.
This pin is connected to the power supply.
The device system core is supplied by this input.
A 1 m F low ESR ceramic capacitor, or larger, must be connected between this pin and GND.
The three IN pins must be hardwired to common supply.
2
3
GND
FLAG
POWER
OUTPUT
Ground
Fault Indication Pin.
This pin allows an external system to detect a fault on IN pin.
The FLAG pin goes low when input voltage exceeds OVLO threshold or drop below UVLO threshold.
Since the FLAG pin is open drain functionality, an external pull up resistor to V CC must be added.
6
7
OUT
OUTPUT
Output Voltage Pin.
This pin follows IN pin when “no fault” is detected.
The output is disconnected from the V in power supply when the input voltage is under the UVLO
threshold or above OVLO threshold.
The two OUT pins must be hardwired to common supply.
8
9
10
NC
NC
EN
OPEN
OPEN
INPUT
No Connect
No Connect
Enable Pin.
The device enters in shutdown mode when this pin is tied to a high level. In this case the output is
disconnected from the input.
To allow normal functionality, the EN pin shall be connected to GND to a pull down or to a I/O pin.
This pin does not have an impact on the fault detection.
PAD1
PAD2
MAXIMUM RATINGS
PAD1, under the device. See PCB recommendations page 10.
Can be shorted to GND.
The PAD2 is electrically connected to the internal NMOS drain and connected to Pins 4 and 5.
See PCB recommendations page 10.
Rating
Minimum Voltage (IN to GND)
Minimum Voltage (All others to GND)
Maximum Voltage (IN to GND)
Maximum Voltage (All others to GND)
Maximum Current (UVLO<V IN <OVLO)
Thermal Resistance, Junction ? to ? Air (Note 1)
Operating Ambient Temperature Range
Storage Temperature Range
Junction Operating Temperature
ESD Withstand Voltage (IEC 61000 ? 4 ? 2) (input only) when bypassed with 1.0 m F capacitor
Human Body Model (HBM), Model = 2 (Note 2)
Machine Model (MM) Model = B (Note 3)
Moisture Sensitivity
Symbol
Vmin in
Vmin
Vmax in
Vmax
Imax
R q JA
T A
T stg
T J
Vesd
MSL
Value
? 0.3
? 0.3
30
7.0
2.0
280
? 40 to +85
? 65 to +150
150
15 Air, 8.0 Contact
2000
200
Level 1
Unit
V
V
V
V
A
° C/W
° C
° C
° C
kV
V
V
?
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The R q JA is highly dependent on the PCB heat sink area (connected to pad 2). As example R q JA is 268 ° C/W with 30 mm 2 (copper 35 m m) and
189 ° C/W with 400 mm 2 .
2. Human Body Model, 100 pF discharged through a 1.5 k W resistor following specification JESD22/A114.
3. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.
http://onsemi.com
3
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