参数资料
| 型号： | NCP4894MNR2 |
| 厂商： | ON Semiconductor |
| 文件页数： | 10/19页 |
| 文件大小： | 0K |
| 描述： | IC AMP AUDIO PWR 1W DIFF 10-DFN |
| 产品变化通告： | LTB Notification 03/Jan/2008 |
| 标准包装： | 3,000 |
| 类型： | AB 类 |
| 输出类型： | 1-通道（单声道） |
| 在某负载时最大输出功率 x 通道数量： | 1.8W x 1 @ 8 欧姆 |
| 电源电压： | 2.2 V ~ 5.5 V |
| 特点： | 消除爆音，差分输入，短路和热保护，关闭 |
| 安装类型： | 表面贴装 |
| 供应商设备封装： | 10-DFN（3x3） |
| 封装/外壳： | 10-VFDFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
NCP4894
http://onsemi.com
18
PACKAGE DIMENSIONS
DFN10
MN SUFFIX
CASE 485C01
ISSUE A
10X
SEATING
PLANE
L
D
E
0.15 C
A
A1
e
D2
E2
b
15
10
6
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. TERMINAL b MAY HAVE MOLD COMPOUND
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
6. DETAILS A AND B SHOW OPTIONAL VIEWS
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
B
A
0.15 C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PIN 1
REFERENCE
0.10 C
0.08 C
(A3)
C
10X
0.10 C
0.05 C
A B
NOTE 3
K
10X
DIM
MIN
MAX
MILLIMETERS
A
0.80
1.00
A1
0.00
0.05
A3
0.20 REF
b
0.18
0.30
D
3.00 BSC
D2
2.45
2.55
E
3.00 BSC
E2
1.75
1.85
e
0.50 BSC
L
0.35
0.45
L1
0.00
0.03
DETAIL A
K
0.19 TYP
2X
L1
DETAIL A
Bottom View
(Optional)
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
DETAIL B
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.1746
2.6016
1.8508
0.5000 PITCH
0.5651
10X
3.3048
0.3008
10X
DIMENSIONS: MILLIMETERS
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