参数资料
型号: NCP500SN33T1G
厂商: ON Semiconductor
文件页数: 17/18页
文件大小: 0K
描述: IC REG LDO 3.3V .15A 5TSOP
标准包装: 1
稳压器拓扑结构: 正,固定式
输出电压: 3.3V
输入电压: 最高 6V
电压 - 压降(标准): 0.15V @ 150mA
稳压器数量: 1
电流 - 输出: 150mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 6-TSOP(0.059",1.50mm 宽)5 引线
供应商设备封装: 5-TSOP
包装: 标准包装
产品目录页面: 1119 (CN2011-ZH PDF)
其它名称: NCP500SN33T1GOSDKR
NCP500, NCV500
PACKAGE DIMENSIONS
TSOP ? 5
SN SUFFIX
CASE 483 ? 02
ISSUE K
B
C
0 _ 10 _
2X
NOTE 5
2X 0.10 T
0.20 T
B
A
0.05
5 4
1 2 3
G
A
TOP VIEW
H
SIDE VIEW
C
D 5X
0.20 C A B
S
SEATING
PLANE
J
K
M
DETAIL Z
DETAIL Z
END VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
MILLIMETERS
DIM MIN MAX
A 3.00 BSC
B 1.50 BSC
C 0.90 1.10
D 0.25 0.50
G 0.95 BSC
H 0.01 0.10
J 0.10 0.26
K 0.20 0.60
M
S 2.50 3.00
SOLDERING FOOTPRINT*
1.9
0.95
0.074
0.037
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
17
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