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参数资料
| 型号： | NCP500SQL50T1G |
| 厂商： | ON Semiconductor |
| 文件页数： | 17/18页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 5V .15A 6-DFN |
| 标准包装： | 3,000 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 5V |
| 输入电压： | 最高 6V |
| 电压 - 压降（标准）： | 0.12V @ 150mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 150mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-VDFN 裸露焊盘 |
| 供应商设备封装： | 6-DFN（2x2.2） |
| 包装： | 带卷 (TR) |
| 其它名称： | NCP500SQL50T1GOS |
NCP500, NCV500
PACKAGE DIMENSIONS
TSOP ? 5
SN SUFFIX
CASE 483 ? 02
ISSUE K
B
C
0 _ 10 _
2X
NOTE 5
2X 0.10 T
0.20 T
B
A
0.05
5 4
1 2 3
G
A
TOP VIEW
H
SIDE VIEW
C
D 5X
0.20 C A B
S
SEATING
PLANE
J
K
M
DETAIL Z
DETAIL Z
END VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
MILLIMETERS
DIM MIN MAX
A 3.00 BSC
B 1.50 BSC
C 0.90 1.10
D 0.25 0.50
G 0.95 BSC
H 0.01 0.10
J 0.10 0.26
K 0.20 0.60
M
S 2.50 3.00
SOLDERING FOOTPRINT*
1.9
0.95
0.074
0.037
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
17
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