参数资料
型号: NCP5603GEVB
厂商: ON Semiconductor
文件页数: 12/13页
文件大小: 0K
描述: EVAL BOARD FOR NCP5603G HI FREQ
设计资源: NCP5603 EVB BOM
NCP5603GEVB Gerber Files
NCP5603 EVB Schematic
标准包装: 1
电流 - 输出 / 通道: 160mA
输出及类型: 1,非隔离
输出电压: 4.5 ~ 5 V
特点: 可调光
输入电压: 3V or 3.6V
已供物品:
已用 IC / 零件: NCP5603
其它名称: NCP5603GEVBOS
NCP5603
PACKAGE DIMENSIONS
DFN10, 3x3
MN SUFFIX
CASE 485C-01
ISSUE A
D
A
NOTES:
B
E
L1
EDGE OF PACKAGE
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. TERMINAL b MAY HAVE MOLD COMPOUND
MATERIAL ALONG SIDE EDGE. MOLD
2X
PIN 1
REFERENCE
0.15 C
DETAIL A
Bottom View
(Optional)
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
6. DETAILS A AND B SHOW OPTIONAL VIEWS
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
2X
0.15 C
TOP VIEW
DIM
MILLIMETERS
MIN MAX
A
0.80 1.00
DETAIL B
(A3)
A1
A3
0.00 0.05
0.20 REF
0.10 C
A
b
D
D2
0.18 0.30
3.00 BSC
2.45 2.55
10X
0.08 C
SIDE VIEW
A1
C
SEATING
PLANE
E
E2
e
K
3.00 BSC
1.75 1.85
0.50 BSC
0.19 TYP
L
0.35 0.45
EXPOSED Cu
L1
0.00 0.03
D2
DETAIL A
MOLD CMPD
10X
L
1
e
5
A3
A1
10X
K
E2
DETAIL B
Side View
(Optional)
SOLDERING FOOTPRINT*
10
6
10X
0.10 C A B
b
BOTTOM VIEW
2.6016
0.05 C
NOTE 3
2.1746
10X
0.5651
10X
1.8508
3.3048
0.3008
0.5000 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
12
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