参数资料
型号: NCP600SNADJT1G
厂商: ON Semiconductor
文件页数: 14/15页
文件大小: 0K
描述: IC REG LDO ADJ .15A 5TSOP
标准包装: 1
稳压器拓扑结构: 正,可调式
输出电压: 1.25 V ~ 5 V
输入电压: 1.75 V ~ 6 V
电压 - 压降(标准): 0.075V @ 150mA
稳压器数量: 1
电流 - 输出: 150mA(最小值)
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 6-TSOP(0.059",1.50mm 宽)5 引线
供应商设备封装: 5-TSOP
包装: 剪切带 (CT)
其它名称: NCP600SNADJT1GOSCT
NCP600
PACKAGE DIMENSIONS
TSOP ? 5
CASE 483 ? 02
ISSUE H
2X
2X
NOTE 5
0.10 T
0.20 T
L
5
1
2
A
G
4
3
B
D 5X
S
0.20 C A B
K
DETAIL Z
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
MILLIMETERS
0 _ _
0.05
H
C
T
SEATING
PLANE
DETAIL Z
J
SOLDERING FOOTPRINT*
1.9
DIM
A
B
C
D
G
H
J
K
L
M
S
MIN MAX
3.00 BSC
1.50 BSC
0.90 1.10
0.25 0.50
0.95 BSC
0.01 0.10
0.10 0.26
0.20 0.60
1.25 1.55
10
2.50 3.00
0.95
0.074
0.037
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
14
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