参数资料
型号: NCP623MN-30R2G
厂商: ON Semiconductor
文件页数: 2/16页
文件大小: 0K
描述: IC REG LDO 3V .15A 6-DFN
标准包装: 3,000
稳压器拓扑结构: 正,固定式
输出电压: 3V
输入电压: 最高 12V
电压 - 压降(标准): 0.18V @ 150mA
稳压器数量: 1
电流 - 输出: 150mA
电流 - 限制(最小): 175mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 6-VDFN 裸露焊盘
供应商设备封装: 6-DFN(3x3)
包装: 带卷 (TR)
NCP623
V IN
On/Off
Bypass
GND
ON/OFF
Band Gap
Reference
* Current Limit
* Antisaturation
* Protection
Thermal
Shutdown
V OUT
GND
Figure 1. NCP623 Block Diagram
MAXIMUM RATINGS
Power Supply Voltage
Rating
Symbol
V in
Value
12
Unit
V
Power Dissipation and Thermal Resistance
Maximum Power Dissipation
Case 488AE (DFN6, 3x3) MN Suffix
Thermal Resistance, Junction ? to ? Air
Thermal Resistance, Junction ? to ? Case
Case 846A (Micro8) DM Suffix
Thermal Resistance, Junction ? to ? Air
Thermal Resistance, Junction ? to ? Case
Operating Ambient Temperature Range
Maximum Junction Temperature
Storage Temperature Range
P D
R q JA
**psi ? JC* or Y JC
R q JA
R q JC
T A
T Jmax
T stg
Internally Limited
161
13
240
105
? 40 to +85
150
? 60 to +150
W
° C/W
° C
° C
° C
ESD Protection
? Human Body Model
? Machine Model
V ESD
2000
200
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*“C’’ (“case’’) is defined as the solder ? attach interface between the center of the exposed pad on the bottom of the package, and the board to
which it is attached.
** Refer to the JEDEC Specs (51 ? 2, 51 ? 6).
http://onsemi.com
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