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参数资料
| 型号： | NCS2220AGEVB |
| 厂商： | ON Semiconductor |
| 文件页数： | 9/9页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR NCS2220A UDFN6 |
| 设计资源： | NCS2220A Schematic |
| 标准包装： | 1 |
| 主要目的： | 比较器，双路 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | NCS2220A |
| 已供物品： | 板 |
| 其它名称： | NCS2220AGEVB-ND NCS2220AGEVBOS |
NCS2220A
http://onsemi.com
9
PACKAGE DIMENSIONS
UDFN8, 1.6x1.6, 0.4P
CASE 517AC01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. EXPOSED PADS CONNECTED TO DIE FLAG.
USED AS TEST CONTACTS.
A
B
E
D
D2
E2
BOTTOM VIEW
b
e
8X
0.10
B
0.05
A
C
K
8X
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
8X
A
A1
(A3)
0.08 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
L
8X
1
4
5
8
DIM MIN
NOM
MAX
MILLIMETERS
A
0.45
0.50
0.55
A1
0.00
0.03
0.05
A3
0.127 REF
b
0.15
0.20
0.25
D
1.60 BSC
D2
0.70
0.80
0.90
E
1.60 BSC
E2
0.40
0.50
0.60
e
0.40 BSC
K
0.20
L
0.20
0.30
0.40
(A3)
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
mm
inches
SCALE 20:1
0.902
0.0355
0.924
0.0364
0.490
0.0193
0.400
0.0157
PITCH
0.502
0.0197
0.200
0.0079
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PUBLICATION ORDERING INFORMATION
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Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81358171050
NCS2220A/D
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For additional information, please contact your local
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