参数资料
| 型号： | NCS2561SQT1G |
| 厂商： | ON Semiconductor |
| 文件页数： | 4/11页 |
| 文件大小： | 0K |
| 描述： | IC OP AMP HS W/FILTER SC-88 |
| 标准包装： | 3,000 |
| 应用： | 滤波器 |
| 电路数： | 1 |
| 电流 - 电源： | 6mA |
| 电流 - 输出 / 通道： | 50mA |
| 电压 - 电源，单路/双路(±)： | 2.7 V ~ 3.3 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-TSSOP，SC-88，SOT-363 |
| 供应商设备封装： | SC-88 |
| 包装： | 带卷 (TR) |
| 其它名称： | NCS2561SQT1G-ND NCS2561SQT1GOSTR |
NCS2561
http://onsemi.com
2
PIN FUNCTION AND DESCRIPTION
Pin
Name
Type
Description
1
IN
Input
Video Input
2
GND
Ground
3
SAG
Output
Sag Compensation
4
OUT
Output
Video Output
5
Enable
Input
Enable / Disable Function: High = Enable, Low = Disable. When left open the default state is High.
6
VCC
Power
Power Supply / 2.7 V ≤ VCC ≤ 3.3 V
ATTRIBUTES
Characteristic
Value
ESD Protection
Human Body Model, R = 1000 W, C = 100 pF
Machine Model
2 kV
200 V
Moisture Sensitivity (Note 1)
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Power Supply Voltages
VCC
3.6
Vdc
Input Voltage Range
VI
0.5 to VCC + 0.5
Vdc
Output ShortCircuit to GND thru 75 W
ISC
Continuous
Maximum Junction Temperature (Note 2)
TJ
150
°C
Operating Ambient Temperature
TA
40 to +125
°C
Storage Temperature Range
Tstg
60 to +150
°C
Thermal Resistance, JunctiontoAir
RqJA
250
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated is
limited by the associated rise in junction temperature. For
the plastic packages, the maximum safe junction
temperature is 150
°C. If the maximum is exceeded
momentarily, proper circuit operation will be restored as
soon as the die temperature is reduced. Leaving the device
in the “overheated” condition for an extended period can
result in device burnout. To ensure proper operation, it is
important to observe the derating curves.
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