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| 型号： | NCT1008DMT3R2G |
| 厂商： | ON Semiconductor |
| 文件页数： | 20/20页 |
| 文件大小： | 327K |
| 描述： | TMP DIO MON/SMBUS 4CH 8WDFN |
| 标准包装： | 3,000 |
| 功能： | 温度监控系统（传感器） |
| 传感器类型： | 内部和外部 |
| 感应温度： | 0°C ~ 127°C，-64°C ~ 191°C |
| 精确度： | ±2.5°C（最小值） |
| 拓扑： | ADC（三角积分型），比较器，多路复用器，寄存器库 |
| 输出类型： | I²C?/SMBus? |
| 输出警报： | 是 |
| 输出风扇： | 是 |
| 电源电压： | 2.8 V ~ 3.6 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-WFDFN |
| 供应商设备封装： | 8-WDFN（2x2） |
| 包装： | 带卷 (TR) |
NCT1008
http://onsemi.com
20
PACKAGE DIMENSIONS
DFN8 3x3, 0.5P
CASE 506BJ01
ISSUE O
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERMASK DEFINED
3.30
8X
DIMENSION: MILLIMETERS
0.63
1.55
1.85
0.50
PITCH
8X
0.35
MOUNTING FOOTPRINT*
PIN 1
REFERENCE
A
B
C
0.10
2X
2X
TOP VIEW
D
E
C
0.10
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30
MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
E2
BOTTOM VIEW
b
0.10
8X
L
1
4
0.05
C
A B
C
D2
e
K
8
5
8X
8X
(A3)
C
C
0.05
8X
C
0.05
SIDE VIEW
A1
A
SEATING
PLANE
DIM MIN
MAX
MILLIMETERS
A
0.80
1.00
A1 0.00
0.05
A3
0.20 REF
b
0.18
0.30
D
3.00 BSC
D2 1.64
1.84
E
3.00 BSC
E2 1.35
1.55
e
0.50 BSC
K
0.20
L
0.30
0.50
NOTE 3
L
DETAIL A
OPTIONAL
CONSTRUCTION
L1
DETAIL A
DETAIL B
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
L
OPTIONAL
CONSTRUCTION
OPTIONAL
CONSTRUCTION
L1 0.00
0.03
NOTE 4
DETAIL B
DETAIL A
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NCT1008/D
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