参数资料
型号: NCV2200SN2T1G
厂商: ON Semiconductor
文件页数: 7/17页
文件大小: 0K
描述: IC COMPARATOR COMPL SOT-23-5
标准包装: 3,000
类型: 通用
元件数: 1
输出类型: 补充型,满摆幅
电压 - 电源,单路/双路(±): 0.85 V ~ 6 V
电压 - 输入偏移(最小值): 5mV @ 6V
电流 - 输入偏压(最小值): 1pA
电流 - 静态(最大值): 10µA
CMRR, PSRR(标准): 70dB CMRR,80dB PSRR
传输延迟(最大): 1.3ms
磁滞: 20mV
工作温度: -40°C ~ 125°C
封装/外壳: 6-TSOP(0.059",1.50mm 宽)5 引线
安装类型: 表面贴装
包装: 带卷 (TR)
NCS2200, NCS2200A, NCV2200
http://onsemi.com
15
PACKAGE DIMENSIONS
DFN6, 2x2.2
SQL SUFFIX
CASE 48803
ISSUE G
0.50
0.020
SCALE 10:1
0.40
0.016
1.9
0.075
0.65
0.025
0.65
0.025
0.50
0.020
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. TERMINAL b MAY HAVE MOLD COMPOUND
MATERIAL ALONG SIDE EDGE.
6. DETAILS A AND B SHOW OPTIONAL VIEWS
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE AND SIDE EDGE OF PACKAGE.
C
A
SEATING
PLANE
D
B
E
0.10 C
A3
A
A1
2X
0.10 C
DIM
A
MIN
NOM
MILLIMETERS
0.80
0.90
A1
0.00
0.03
A3
0.20 REF
b
0.20
0.25
D
2.00 BSC
D2
0.40
0.50
0.30
0.35
E
2.20 BSC
b1
e
0.65 BSC
0.30
0.35
L
PIN ONE
REFERENCE
0.08 C
0.10 C
6X
A
0.10 C
NOTE 3
e
b1
D2
b
B
3
6
5X
1
L
4
6X
0.05 C
BOTTOM VIEW
MAX
1.00
0.05
0.30
0.60
0.40
SIDE VIEW
TOP VIEW
A
0.10 C
NOTE 3
B
0.05 C
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DETAIL B
DETAIL A
L1
DETAIL A
Bottom View
(Optional)
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
0.00
0.05
L1
0.10
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