参数资料
型号: NCV33064DM-5R2G
厂商: ON Semiconductor
文件页数: 10/11页
文件大小: 0K
描述: IC UNDERVOLTAGE SENSOR MICRO8
标准包装: 1
类型: 简单复位/加电复位
监视电压数目: 1
输出: 开路漏极或开路集电极
复位: 低有效
电压 - 阀值: 4.6V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
供应商设备封装: Micro8?
包装: 剪切带 (CT)
其它名称: NCV33064DM-5R2GOSCT
MC34064, MC33064, NCV33064
PACKAGE DIMENSIONS
TSOP ? 5
SN SUFFIX
CASE 483 ? 02
ISSUE H
2X
2X
NOTE 5
0.10 T
0.20 T
L
5
1
2
A
G
4
3
B
D 5X
S
0.20 C A B
K
DETAIL Z
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
MILLIMETERS
0 _ _
0.05
H
C
T
SEATING
PLANE
J
DETAIL Z
DIM
A
B
C
D
G
H
J
K
L
M
S
MIN MAX
3.00 BSC
1.50 BSC
0.90 1.10
0.25 0.50
0.95 BSC
0.01 0.10
0.10 0.26
0.20 0.60
1.25 1.55
10
2.50 3.00
SOLDERING FOOTPRINT*
1.9
0.95
0.074
0.037
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
10
相关PDF资料
PDF描述
NCV33064D-5R2G IC SENSOR UNDERVOLTAGE 8SOIC
RCM43DTKN-S288 CONN EDGECARD 86POS .156 EXTEND
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