参数资料
型号: NCV51411PWR2
厂商: ON Semiconductor
文件页数: 3/16页
文件大小: 0K
描述: IC REG BUCK 1.5A 16SOIC
产品变化通告: LTB Notification 03/Jan/2008
标准包装: 1,000
类型: 降压(降压)
输出数: 1
输入电压: 4.5 V ~ 40 V
PWM 型: 混合物
频率 - 开关: 260kHz
电流 - 输出: 1.5A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.295",7.50mm 宽)裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 16-SOIC W
NCV51411
PACKAGE PIN DESCRIPTION
SO ? 8
1
2
3
4
5
6
7
8
?
SO ? 16
15
16
1
2
7
8
9
10
3 ? 6,
11 ? 14
DFN ? 18
1
2, 3, 4
5, 6, 7
8
10
13
16
17
9, 11, 12,
14, 15, 18
PIN SYMBOL
BOOST
V IN
V SW
SHDNB
SYNC
GND
V FB
V C
NC
FUNCTION
The BOOST pin provides additional drive voltage to the on ? chip NPN power transist-
or. The resulting decrease in switch on voltage increases efficiency.
This pin is the main power input to the IC.
This is the connection to the emitter of the on ? chip NPN power transistor and serves
as the switch output to the inductor. This pin may be subjected to negative voltages
during switch off ? time. A catch diode is required to clamp the pin voltage in normal
operation. This node can stand ? 1.0 V for less than 50 ns during switch node flyback.
Shutdown_bar input. This is an active ? low logical input, TTL compatible, with an in-
ternal pull ? up current source. The IC goes into sleep mode, drawing less than 85 m A
when the pin voltage is pulled below 1.0 V. This pin may be left floating in applications
where a shutdown function is not required.
This pin provides the synchronization input.
Power return connection for the IC.
The FB pin provides input to the inverting input of the error amplifier. If V FB is lower
than 0.29 V, the oscillator frequency is divided by four, and current limit folds back to
about 1 ampere. These features protect the IC under severe overcurrent or short cir-
cuit conditions.
The V C pin provides a connection point to the output of the error amplifier and input to
the PWM comparator. Driving of this pin should be avoided because on ? chip test
circuitry becomes active whenever current exceeding 0.5 mA is forced into the IC.
No Connection
PIN CONNECTIONS
BOOST
V IN
V SW
SHDNB
1
SO ? 8
8
V C
V FB
GND
SYNC
V SW
SHDNB
NC
NC
NC
NC
SYNC
GND
1 16
SO ? 16W EP
V IN
BOOST
NC
NC
NC
NC
V C
V FB
BOOST
V IN
V IN
V IN
Vsw
V SW
V SW
SHDNB
NC
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
NC
V C
V FB
NC
NC
GND
NC
NC
SYNC
18 ? Lead DFN
Note: DFN exposed pad may be soldered to a
heat spreader for enhanced thermal perform-
ance. The exposed pad may be connected to
GND; do not connect to any other potential.
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