参数资料
型号: NCV7356D2
厂商: ON Semiconductor
文件页数: 9/24页
文件大小: 0K
描述: IC TXRX CAN SGL WIRE 14-SOIC
产品变化通告: Product Discontinuation 27/Jun/2007
标准包装: 55
类型: 收发器
驱动器/接收器数: 1/1
规程: CAN
电源电压: 5 V ~ 27 V
安装类型: 表面贴装
封装/外壳: 14-SOIC(0.154",3.90mm 宽)
供应商设备封装: 14-SOICN
包装: 管件
NCV7356
http://onsemi.com
17
SOIC8 Thermal Information
Parameter
Test Condition, Typical Value
Unit
Min Pad Board
(Note 22)
1, Pad Board
(Note 23)
JunctiontoLead (psiJL7, YJL8) or Pins 67
57
51
°C/W
JunctiontoAmbient (RqJA, qJA)
187
128
°C/W
22.1 oz copper, 53 mm2 coper area, 0.062″ thick FR4.
23.1 oz copper, 716 mm2 coper area, 0.062″ thick FR4.
Package Construction
with and without Mold Compound
Figure 10. Internal construction of the
package simulation.
Figure 11. Min pad is shown as the red traces.
1, pad includes the yellow area. Internal
construction is shown for later reference.
Various copper areas used
for heat spreading
Active Area (red)
Lead #1
0
100
200
300
400
500
600
800
2.0 oz. Cu
Figure 12. SOIC8, qJA as a Function of the Pad Copper
Area Including Traces,
Board Material
q
JA
C/W)
160
Copper Area (mm2)
1.0 oz. Cu
700
150
140
130
120
110
100
190
180
170
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