参数资料
型号: NCV7680PWR2GEVB
厂商: ON Semiconductor
文件页数: 6/20页
文件大小: 0K
描述: BOARD DEMO REAR COMBO LAMP
标准包装: 1
系列: *
NCV7680
Table 2. PIN FUNCTION DESCRIPTION (16 Pin SO Wide Exposed Pad Package)
Pin #
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
epad*
Label
OUT1
VP
Ballast Drive
FB
STOP/PWM
DIAG
RSTOP
RTAIL
OUT8
OUT7
OUT6
OUT5
GND
OUT4
OUT3
OUT2
epad
Description
Channel 1 constant current output to LED.
Unused pin should be grounded.
Supply Voltage Input.
Gate drive for external power distribution PFET.
Ground if not used.
Feedback Sense node for V P regulation.
Use feedback resistor divider or connect to V P with a 10k resistor.
Stop Logic Input. External Modulation Input.
Open ? drain diagnostic output.
Reporting Open Circuit, R STOP Current Limit,
and Overvoltage Set Back Current down 20%.
Normal Operation = LOW.
Ground if not used.
Stop current bias program resistor.
Tail current duty cycle PWM program resistor.
Ground if using external modulation.
Channel 8 constant current output to LED.
Unused pin should be grounded.
Channel 7 constant current output to LED.
Unused pin should be grounded.
Channel 6 constant current output to LED.
Unused pin should be grounded.
Channel 5 constant current output to LED.
Unused pin should be grounded.
Ground.
Channel 4 constant current output to LED.
Unused pin should be grounded.
Channel 3 constant current output to LED.
Unused pin should be grounded.
Channel 2 constant current output to LED.
Unused pin should be grounded.
Ground. Do not connect to pcb traces other than GND.
*Grounding will provide better thermal and electrical performance.
MAXIMUM RATINGS (Voltages are with respect to device substrate)
Rating
VP, Ballast Drive, STOP, DIAG
DC
Peak Transient
Output Pin Voltage (OUTX)
Output Pin Current (OUTX)
Input Voltage (RTAIL, RSTOP, FB)
Junction Temperature, T J
Peak Reflow Soldering Temperature: Pb ? Free
60 to 150 seconds at 217 ° C (Note 1)
Value
? 0.3 to 45
45
? 0.3 to 45
100
? 0.3 to 5
? 40 to 150
260 peak
Unit
V
V
mA
V
° C
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. For additional information, see or download ON Semiconductor ’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D,
and Application Note AND8003/D.
http://onsemi.com
6
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