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| 型号： | NCV8502D50R2G |
| 厂商： | ON Semiconductor |
| 文件页数： | 11/14页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 5V .15A 8SOIC |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 5V |
| 输入电压： | 最高 45 V |
| 电压 - 压降（标准）： | 0.4V @ 150mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 150mA |
| 电流 - 限制（最小）： | 151mA |
| 工作温度： | -40°C ~ 150°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOICN |
| 包装： | 剪切带 (CT) |
| 其它名称： | NCV8502D50R2GOSCT |
NCV8502 Series
CALCULATING POWER DISSIPATION IN A
SINGLE OUTPUT LINEAR REGULATOR
The maximum power dissipation for a single output
regulator (Figure 19) is:
100
90
PD(max) + [VIN(max) * VOUT(min)] IOUT(max)
) VIN(max)IQ
(eq. 1)
80
70
R Q JA + 150C * A
T
where:
V IN(max) is the maximum input voltage,
V OUT(min) is the minimum output voltage,
I OUT(max) is the maximum output current for the
application, and
I Q is the quiescent current the regulator consumes at
I OUT(max) .
Once the value of P D(max) is known, the maximum
permissible value of R q JA can be calculated:
(eq. 2)
PD
The value of R q JA can then be compared with those in the
package section of the data sheet. Those packages with
R q JA ’s less than the calculated value in equation 2 will keep
the die temperature below 150 ° C.
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
60
50
40
0 200 400 600 800
Copper Area (mm 2 )
Figure 20. 16 Lead SOW (Exposed Pad), q JA as a
Function of the Pad Copper Area (2 oz. Cu
Thickness), Board Material = 0.0625 , G ? 10/R ? 4
HEAT SINKS
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
R q JA + R q JC ) R q CS ) R q SA
V IN
I IN
SMART
REGULATOR ?
I OUT
V OUT
series electrical resistances, these resistances are summed to
determine the value of R q JA :
(eq. 3)
}
Control
Features
I Q
where:
R q JC = the junction ? to ? case thermal resistance,
R q CS = the case ? to ? heatsink thermal resistance, and
R q SA = the heatsink ? to ? ambient thermal resistance.
Figure 19. Single Output Regulator with Key
Performance Parameters Labeled
R q JC appears in the package section of the data sheet. Like
R q JA , it too is a function of package type. R q CS and R q SA are
functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.
http://onsemi.com
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相关代理商/技术参数 |
参数描述 |
|---|---|
| NCV8502D80 | 功能描述:低压差稳压器 - LDO 8.0V 150mA w/Delay RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| NCV8502D80G | 功能描述:低压差稳压器 - LDO 8.0V 150mA w/Delay RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| NCV8502D80R2 | 功能描述:低压差稳压器 - LDO 8.0V 150mA w/Delay RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| NCV8502D80R2G | 功能描述:低压差稳压器 - LDO 8.0V 150mA w/Delay RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| NCV8502DADJ | 功能描述:低压差稳压器 - LDO 150mA ADJ w/Delay RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
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