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| 型号： | NCV8504PW25G |
| 厂商： | ON Semiconductor |
| 文件页数： | 11/12页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 2.5V .4A 16-SOIC |
| 标准包装： | 47 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 2.5V |
| 输入电压： | 最高 45 V |
| 稳压器数量： | 1 |
| 电流 - 输出： | 400mA |
| 电流 - 限制（最小）： | 425mA |
| 工作温度： | -40°C ~ 150°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.295"，7.50mm 宽）裸露焊盘 |
| 供应商设备封装： | 16-SOIC W |
| 包装： | 管件 |
NCV8504 Series
100
90
80
70
HEAT SINKS
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
60
determine the value of R q JA :
R q JA + R q JC ) R q CS ) R q SA
(3)
50
40
0 200 400 600 800
Copper Area (mm 2 )
Figure 20. 16 Lead SOW (Exposed Pad), q JA as a
Function of the Pad Copper Area (2 oz. Cu
Thickness), Board Material = 0.0625 , G ? 10/R ? 4
where:
R q JC = the junction ? to ? case thermal resistance,
R q CS = the case ? to ? heatsink thermal resistance, and
R q SA = the heatsink ? to ? ambient thermal resistance.
R q JC appears in the package section of the data sheet. Like
R q JA , it too is a function of package type. R q CS and R q SA are
functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.
ORDERING INFORMATION
Device
NCV8504PWADJG
NCV8504PWADJR2G
NCV8504PW25G
NCV8504PW25R2G
NCV8504PW33G
NCV8504PW33R2G
NCV8504PW50G
NCV8504PW50R2G
Output Voltage
Adjustable
2.5 V
3.3 V
5.0 V
Package
SOW ? 16 Exposed Pad
(Pb ? Free)
SOW ? 16 Exposed Pad
(Pb ? Free)
SOW ? 16 Exposed Pad
(Pb ? Free)
SOW ? 16 Exposed Pad
(Pb ? Free)
SOW ? 16 Exposed Pad
(Pb ? Free)
SOW ? 16 Exposed Pad
(Pb ? Free)
SOW ? 16 Exposed Pad
(Pb ? Free)
SOW ? 16 Exposed Pad
(Pb ? Free)
Shipping ?
47 Units/Rail
1000 Tape & Reel
47 Units/Rail
1000 Tape & Reel
47 Units/Rail
1000 Tape & Reel
47 Units/Rail
1000 Tape & Reel
?For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
http://onsemi.com
11
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相关代理商/技术参数 |
参数描述 |
|---|---|
| NCV8504PW25R2 | 功能描述:低压差稳压器 - LDO 2.5V 400mA w/Delay RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| NCV8504PW25R2G | 功能描述:低压差稳压器 - LDO 2.5V 400mA w/Delay RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| NCV8504PW33 | 功能描述:低压差稳压器 - LDO 3.3V 400mA w/Delay RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| NCV8504PW33G | 功能描述:低压差稳压器 - LDO 3.3V 400mA w/Delay RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| NCV8504PW33R2 | 功能描述:低压差稳压器 - LDO 3.3V 400mA w/Delay RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
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