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| 型号： | NCV8509PDW25 |
| 厂商： | ON Semiconductor |
| 文件页数： | 15/18页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 5V/2.5V 16-SOIC |
| 产品变化通告： | LTB Notification 03/Jan/2008 |
| 标准包装： | 47 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 5V，2.5V |
| 输入电压： | 最高 50V |
| 电压 - 压降（标准）： | 0.4V @ 100mA |
| 稳压器数量： | 2 |
| 电流 - 限制（最小）： | 115mA，105mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.295"，7.50mm 宽）裸露焊盘 |
| 供应商设备封装： | 16-SOIC W |
| 包装： | 管件 |
NCV8509 Series
Max V IN Delta
I(V IN2 ) × R EX
Shunt Off
4.5 V
Shunt On
V IN1
Mode 1
V IN2
Mode 3
VIN1 t VREF ) VSAT
VIN2 + VIN1 * VSAT
VIN1 u VREF ) (IOUT2
VIN2 + VIN1 * (IOUT2
Mode 2
VREF ) VSAT t VIN1 t VREF ) (IOUT2
REX)
VIN2 + VREF
Figure 50. V IN Shunt
REX)
REX)
100
90
80
70
60
50
R q JA ’s less than the calculated value in equation 2 will keep
the die temperature below 150 ° C.
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
Heat Sinks
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
40
0
200
400
Copper Area (mm 2 )
600
800
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of R q JA :
R q JA + 150C * A
R q JA + R q JC ) R q CS ) R q SA
Figure 51. 16 Lead SOW (Exposed Pad), q JA as a
Function of the Pad Copper Area (2 oz. Cu
Thickness), Board Material = 0.0625 , G ? 10/R ? 4
Once the value of P IC(max) is known, the maximum
permissible value of R q JA can be calculated:
T (8)
PIC
The value of R q JA can then be compared with those in the
package section of the data sheet. Those packages with
(9)
where:
R q JC = the junction ? to ? case thermal resistance,
R q CS = the case ? to ? heatsink thermal resistance, and
R q SA = the heatsink ? to ? ambient thermal resistance.
R q JC appears in the package section of the data sheet. Like
R q JA , it too is a function of package type. R q CS and R q SA are
functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.
http://onsemi.com
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相关代理商/技术参数 |
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|---|---|
| NCV8509PDW25G | 功能描述:线性稳压器 - 标准 2.5V 100mA Sequenced Dual RoHS:否 制造商:STMicroelectronics 输出类型: 极性: 输出电压:1.8 V 输出电流:150 mA 负载调节: 最大输入电压:5.5 V 线路调整率: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SOT-323-5L |
| NCV8509PDW25R2 | 功能描述:线性稳压器 - 标准 2.5V 100mA Sequenced RoHS:否 制造商:STMicroelectronics 输出类型: 极性: 输出电压:1.8 V 输出电流:150 mA 负载调节: 最大输入电压:5.5 V 线路调整率: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SOT-323-5L |
| NCV8509PDW25R2G | 功能描述:线性稳压器 - 标准 2.5V 100mA Sequenced Dual RoHS:否 制造商:STMicroelectronics 输出类型: 极性: 输出电压:1.8 V 输出电流:150 mA 负载调节: 最大输入电压:5.5 V 线路调整率: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SOT-323-5L |
| NCV8509PDW26 | 功能描述:线性稳压器 - 标准 2.6V 100mA Sequenced RoHS:否 制造商:STMicroelectronics 输出类型: 极性: 输出电压:1.8 V 输出电流:150 mA 负载调节: 最大输入电压:5.5 V 线路调整率: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SOT-323-5L |
| NCV8509PDW26G | 功能描述:线性稳压器 - 标准 2.6V 100mA Sequenced Dual RoHS:否 制造商:STMicroelectronics 输出类型: 极性: 输出电压:1.8 V 输出电流:150 mA 负载调节: 最大输入电压:5.5 V 线路调整率: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SOT-323-5L |
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