参数资料
型号: NCV8518APWR2G
厂商: ON Semiconductor
文件页数: 4/13页
文件大小: 0K
描述: IC REG LDO 5V .25A 16-SOIC
标准包装: 1,000
稳压器拓扑结构: 正,固定式
输出电压: 5V
输入电压: 6 V ~ 28 V
电压 - 压降(标准): 0.425V @ 150mA
稳压器数量: 1
电流 - 输出: 250mA
电流 - 限制(最小): 255mA
工作温度: -40°C ~ 150°C
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.295",7.50mm 宽)裸露焊盘
供应商设备封装: 16-SOIC W
包装: 带卷 (TR)
NCV8518A
MAXIMUM RATINGS
Rating
Input Voltage
ENABLE Voltage
(ENABLE may be connected to V IN through an external 20k resistor without damage)
Output Voltage
RESET Voltage
RESET Current
(RESET may be incidentally shorted either to V OUT or to GND without damage)
ESD Susceptibility (Human Body Model)
Logic Inputs/Outputs (Reset, WDI, Wake Up, Delay)
Operating Junction Temperature
Storage Temperature Range
Moisture Sensitivity Level
SOIC ? 16 EP (Case 751R)
SOIC ? 8 EP (Case 751AC)
Symbol
V IN
V ENABLE
V OUT
V RESET
I RESET
?
?
T J
T S
MSL
Value
? 0.3 to 45
? 0.3 to 16
? 0.3 to +7.0
0 V to V OUT
Internally
Limited
2.0
? 0.3 to +7.0
? 40 to150
? 55 to +150
1
2
Unit
V
V
V
V
mA
kV
V
° C
° C
Lead Temperature Soldering: Reflow
Leaded Part 60 ? 150 sec above 183 ° C, 30 sec max at peak
Lead ? Free Part 60 ? 150 sec above 217 ° C, 40 sec max at peak
?
?
240 peak
265 peak
° C
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Parameter
SO ? 8 Exposed Pad Package
Board/Mounting Conditions Typical Value
100 sq. mm spreader board (Note 1)
1 sq. inch spreader board (Note 2)
Unit
Junction to case top ( Y JT )
Junction to lead1 ( Y JL1 )
Junction to board ( Y JB ) (Note 3)
Junction to ambient ( q JA )
14
36
15
126
14
26
14
80
° C/W
° C/W
° C/W
° C/W
SO ? 16 Exposed Pad Package
100 sq. mm spreader board (Note 1)
1 sq. inch spreader board (Note 2)
Junction to case top ( Y JT )
Junction to lead1 ( Y JL1 )
Junction to board ( Y JB ) (Note 3)
Junction to ambient ( q JA )
20
41
12
113
20
26
12
70
° C/W
° C/W
° C/W
° C/W
Specific notes on thermal characterization conditions:
All boards are 0.062” thick FR4, 3” square, with varying amounts of copper heat spreader, in still air (free convection) conditions. Numerical
values are derived from an axisymmetric finite ? element model where active die area, total die area, flag area, pad area, and board area are
equated to the actual corresponding areas.
1. 1 oz copper, 100 mm 2 (0.155 in 2 ) spreader area (includes exposed pad).
2. 1 oz copper, 645 mm 2 (1 in 2 ) spreader area (includes exposed pad).
3. “board” is defined as center of exposed pad soldered to board; this is the recommended number to be used for thermal calculations, as it
best represents the primary heat flow path and is least sensitive to board and ambient properties.
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